STPS1L40 STMicroelectronics, STPS1L40 Datasheet - Page 4

• Manufacturer Part Number: STPS1L40
• Description: Low Drop Power Schottky Rectifier
• Manufacturer: STMicroelectronics

Characteristics
4/11
Figure 7.
Figure 9.
Figure 11. Relative variation of thermal
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.E-04
7
6
5
4
3
2
1
0
16
14
12
10
1.E-02
1. E- 04
8
6
4
2
0
I M (A)
Z th(j-a) /R th(j-a)
I M (A)
I M
I M
Single pulse
Epoxy printed circuit board,
copper thickness = 35 µm,
recommended pad layout
SMB
δ = 0.5
δ = 0.5
1.E-01
t
t
Non repetitive surge peak forward
current versus overload duration
(maximum values, SMA)
Non repetitive surge peak forward
current versus overload duration
(maximum values, STmite flat)
impedance junction to ambient
versus pulse duration (SMB)
1.E-03
1. E- 03
1.E+00
1.E-02
1. E- 02
t(s)
t(s)
1.E+01
1.E-01
1. E- 01
1.E+02
T a = 25 °C
T a = 125 °C
STmite flat
T c = 125 °C
T c = 25 °C
T c = 75 °C
T a = 75 °C
SMA
t p (s)
1.E+00
1. E+00
Doc ID 5507 Rev 6
1.E+03
Figure 8.
Figure 10. Relative variation of thermal
Figure 12. Relative variation of thermal
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.E-04
7
6
5
4
3
2
1
0
1.E-02
1.E-02
I M (A)
Z th(j-a) /R th(j-a)
Z th(j-a) /R th(j-a)
STmite flat
Single pulse
I M
Epoxy printed circuit board,
copper thickness = 35 µm,
recommended pad layout
Single pulse
Epoxy printed circuit board,
copper thickness = 35 µm,
recommended pad layout
SMA
δ = 0.5
1.E-01
1.E-01
t
Non repetitive surge peak forward
current versus overload duration
(maximum values, SMB)
impedance junction to ambient
versus pulse duration (SMA)
impedance junction to ambient
versus pulse duration (STmite flat)
1.E-03
1.E+00
1.E+00
1.E-02
1.E+01
1.E+01
1.E-01
1.E+02
1.E+02
T a = 125 °C
T a = 25 °C
T a = 75 °C
SMB
STPS1L40
t p (s)
t p (s)
1.E+00
1.E+03
1.E+03