74LVC541AD,118 NXP Semiconductors, 74LVC541AD,118 Datasheet - Page 14

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74LVC541AD,118

Manufacturer Part Number
74LVC541AD,118
Description
IC BUFF/DVR TRI-ST 8BIT 20SOIC
Manufacturer
NXP Semiconductors
Series
74LVCr
Datasheet

Specifications of 74LVC541AD,118

Package / Case
20-SOIC (7.5mm Width)
Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
1
Number Of Bits Per Element
8
Current - Output High, Low
24mA, 24mA
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Logic Family
LVC
Number Of Channels Per Chip
8
Polarity
Non-Inverting
Supply Voltage (max)
3.6 V
Supply Voltage (min)
1.2 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
High Level Output Current
- 24 mA
Input Bias Current (max)
40 uA
Low Level Output Current
24 mA
Minimum Operating Temperature
- 40 C
Output Type
3-State
Propagation Delay Time
14 ns (Typ) @ 1.2 V or 3.9 ns (Typ) @ 2.7 V or 3.3 ns (Typ) @ 3.3 V
Number Of Lines (input / Output)
8 / 8
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-4501-2
74LVC541AD-T
74LVC541AD-T
935260901118
Philips Semiconductors
2003 Nov 12
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
Octal buffer/line driver with 5 V
tolerant inputs/outputs (3-state)
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
OUTLINE
VERSION
SOT360-1
max.
1.1
A
0.15
0.05
A
20
1
1
Z
y
0.95
0.80
A
2
pin 1 index
IEC
0.25
A
3
e
D
0.30
0.19
b
p
MO-153
JEDEC
0.2
0.1
c
b
p
REFERENCES
D
6.6
6.4
0
(1)
11
10
w
E
4.5
4.3
M
(2)
JEITA
scale
0.65
2.5
14
e
c
A
H
6.6
6.2
2
E
A
1
5 mm
L
1
0.75
0.50
L
H
p
E
E
detail X
0.4
0.3
Q
L
L
PROJECTION
EUROPEAN
p
0.2
v
Q
A
(A )
0.13
3
w
Product specification
X
74LVC541A
v
0.1
A
y
M
ISSUE DATE
A
99-12-27
03-02-19
Z
0.5
0.2
(1)
SOT360-1
8
0
o
o

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