74LVC541APW,112 NXP Semiconductors, 74LVC541APW,112 Datasheet - Page 14

IC BUFF/DVR TRI-ST 8BIT 20TSSOP

74LVC541APW,112

Manufacturer Part Number
74LVC541APW,112
Description
IC BUFF/DVR TRI-ST 8BIT 20TSSOP
Manufacturer
NXP Semiconductors
Series
74LVCr
Datasheet

Specifications of 74LVC541APW,112

Logic Type
Buffer/Line Driver, Non-Inverting
Package / Case
20-TSSOP
Number Of Elements
1
Number Of Bits Per Element
8
Current - Output High, Low
24mA, 24mA
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Logic Family
74LVC
Number Of Channels Per Chip
8
Polarity
Non-Inverting
Supply Voltage (max)
3.6 V
Supply Voltage (min)
1.2 V
Maximum Operating Temperature
125 C
Mounting Style
SMD/SMT
High Level Output Current
- 24 mA
Input Bias Current (max)
40 uA
Low Level Output Current
24 mA
Maximum Power Dissipation
500 mW
Minimum Operating Temperature
- 40 C
Output Type
3-State
Propagation Delay Time
6.5 ns
Number Of Lines (input / Output)
8 / 8
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-1587-5
74LVC541APW
935260903112
Philips Semiconductors
2003 Nov 12
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
Octal buffer/line driver with 5 V
tolerant inputs/outputs (3-state)
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
OUTLINE
VERSION
SOT360-1
max.
1.1
A
0.15
0.05
A
20
1
1
Z
y
0.95
0.80
A
2
pin 1 index
IEC
0.25
A
3
e
D
0.30
0.19
b
p
MO-153
JEDEC
0.2
0.1
c
b
p
REFERENCES
D
6.6
6.4
0
(1)
11
10
w
E
4.5
4.3
M
(2)
JEITA
scale
0.65
2.5
14
e
c
A
H
6.6
6.2
2
E
A
1
5 mm
L
1
0.75
0.50
L
H
p
E
E
detail X
0.4
0.3
Q
L
L
PROJECTION
EUROPEAN
p
0.2
v
Q
A
(A )
0.13
3
w
Product specification
X
74LVC541A
v
0.1
A
y
M
ISSUE DATE
A
99-12-27
03-02-19
Z
0.5
0.2
(1)
SOT360-1
8
0
o
o

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