MC74HC244ADWG ON Semiconductor, MC74HC244ADWG Datasheet - Page 7
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MC74HC244ADWG
Manufacturer Part Number
MC74HC244ADWG
Description
IC BUFF/DVR TRI-ST DUAL 20SOIC
Manufacturer
ON Semiconductor
Series
74HCr
Specifications of MC74HC244ADWG
Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
2
Number Of Bits Per Element
4
Current - Output High, Low
7.8mA, 7.8mA
Voltage - Supply
2 V ~ 6 V
Operating Temperature
-55°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
20-SOIC (7.5mm Width)
Circuit Type
Low-Power Schottky
Current, Supply
160 μA
Function Type
8-Channels
Logic Function
Buffer/Driver/Receiver
Number Of Circuits
Octal
Package Type
SOIC-20
Special Features
Non-Inverting, Tri-State
Temperature, Operating, Range
-55 to +125 °C
Voltage, Supply
2 to 6 V
Logic Family
HC
Logical Function
Buffer/Line Driver
Number Of Elements
2
Number Of Channels
8
Number Of Inputs
8
Number Of Outputs
8
Operating Supply Voltage (typ)
2.5/3.3/5V
Output Type
3-State
Polarity
Non-Inverting
Propagation Delay Time
165ns
High Level Output Current
-7.8mA
Low Level Output Current
7.8mA
Operating Supply Voltage (max)
6V
Operating Supply Voltage (min)
2V
Quiescent Current
4uA
Technology
CMOS
Pin Count
20
Mounting
Surface Mount
Operating Temp Range
-55C to 125C
Operating Temperature Classification
Military
Logic Device Type
Buffer, Non Inverting
Supply Voltage Range
2V To 6V
Logic Case Style
SOIC
No. Of Pins
20
Operating Temperature Range
-55°C To +125°C
Msl
MSL 3 - 168 Hours
Family Type
HC
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
MC74HC244ADWG
MC74HC244ADWGOS
MC74HC244ADWGOS
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC74HC244ADWG
Manufacturer:
ON/安森美
Quantity:
20 000
SEATING
PLANE
−T−
20
1
20
1
G
18X
20X
E
e
B
0.25
D
F
−A−
M
T
A
S
D
B
10
20 PL
11
10
11
S
0.25 (0.010)
A1
B
E
N
A
A
B
T
PACKAGE DIMENSIONS
SEATING
PLANE
PLASTIC DIP PACKAGE
K
M
http://onsemi.com
C
T
CASE 738−03
CASE 751D−05
A
N SUFFIX
DW SUFFIX
PDIP−20
ISSUE E
M
SOIC−20
ISSUE G
7
C
J
L
20 PL
0.25 (0.010)
q
M
M
T
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
B
PER ASME Y14.5M, 1994.
PROTRUSION.
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
M
DIM
A1
A
B
C
D
E
e
H
h
L
q
NOTES:
12.65
10.05
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
4. DIMENSION B DOES NOT INCLUDE MOLD
MILLIMETERS
MIN
2.35
0.10
0.35
0.23
7.40
0.25
0.50
1.27 BSC
0
Y14.5M, 1982.
FORMED PARALLEL.
FLASH.
DIM
_
A
B
C
D
E
G
K
M
N
F
J
L
12.95
10.55
MAX
2.65
0.25
0.49
0.32
7.60
0.75
0.90
1.010
0.240
0.150
0.015
0.050
0.008
0.020
0.110
MIN
7
0.050 BSC
0.100 BSC
0.300 BSC
0
_
INCHES
_
1.070
0.260
0.180
0.022
0.070
0.015
0.140
0.040
MAX
15
_
25.66
MILLIMETERS
MIN
6.10
3.81
0.39
1.27
0.21
2.80
0.51
1.27 BSC
2.54 BSC
7.62 BSC
0
_
MAX
27.17
6.60
4.57
0.55
1.77
0.38
3.55
1.01
15
_