74HCT241DB,112 NXP Semiconductors, 74HCT241DB,112 Datasheet - Page 22

• Manufacturer Part Number: 74HCT241DB,112
• Description: IC BUFF/DVR TRI-ST DUAL 20SSOP
• Manufacturer: NXP Semiconductors
• Series: 74HCTr

Specifications of 74HCT241DB,112

• Package / Case: 20-SSOP
• Logic Type: Buffer/Line Driver, Non-Inverting
• Number Of Elements: 2
• Number Of Bits Per Element: 4
• Current - Output High, Low: 6mA, 6mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Mounting Type: Surface Mount
• Logic Family: 74HCT
• Number Of Channels Per Chip: 8
• Polarity: Non-Inverting
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 4.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• High Level Output Current: - 6 mA
• Input Bias Current (max): 8 uA
• Low Level Output Current: 6 mA
• Minimum Operating Temperature: - 40 C
• Output Type: 3-State
• Propagation Delay Time: 11 ns
• Number Of Lines (input / Output): 8 / 8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Operating Temperature: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-2808-5; 935182590112

Philips Semiconductors
January 1996
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
DIMENSIONS (mm are the original dimensions)
Package outline drawings
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT360-1
max.
1.10
A
0.15
0.05
A
20
1
1
Z
y
0.95
0.80
A
2
pin 1 index
IEC
0.25
A
3
e
D
0.30
0.19
b
p
MO-153AC
JEDEC
0.2
0.1
c
b
p
REFERENCES
D
6.6
6.4
0
(1)
11
10
w
E
4.5
4.3
M
(2)
scale
EIAJ
0.65
2.5
22
e
c
A
H
6.6
6.2
2
E
A
1
5 mm
1.0
L
0.75
0.50
L
H
p
E
E
detail X
0.4
0.3
Q
L
L
PROJECTION
EUROPEAN
p
0.2
v
Q
A
(A )
0.13
3
w
X
v
0.1
A
y
M
ISSUE DATE
A
93-06-16
95-02-04
Z
0.5
0.2
(1)
SOT360-1
8
0
o
o