MC74HCT244ANG ON Semiconductor, MC74HCT244ANG Datasheet - Page 5

IC BUFF/DVR/RCVR 3ST DUAL 20DIP

MC74HCT244ANG

Manufacturer Part Number
MC74HCT244ANG
Description
IC BUFF/DVR/RCVR 3ST DUAL 20DIP
Manufacturer
ON Semiconductor
Series
74HCTr

Specifications of MC74HCT244ANG

Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
2
Number Of Bits Per Element
4
Current - Output High, Low
6mA, 6mA
Voltage - Supply
4.5 V ~ 5.5 V
Operating Temperature
-55°C ~ 125°C
Mounting Type
Through Hole
Package / Case
20-DIP (0.300", 7.62mm)
Circuit Type
Low-Power Schottky
Current, Supply
160 μA
Function Type
8-Channels
Logic Function
Buffer/Driver/Receiver
Number Of Circuits
Octal
Package Type
PDIP-20
Special Features
Non-Inverting, Tri-State
Temperature, Operating, Range
-55 to +125 °C
Voltage, Supply
4.5 to 5.5 V
Logic Family
HCT
Number Of Channels Per Chip
8
Polarity
Non-Inverting
Supply Voltage (max)
5.5 V
Supply Voltage (min)
4.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
High Level Output Current
- 6 mA
Low Level Output Current
6 mA
Maximum Power Dissipation
750 mW
Minimum Operating Temperature
- 55 C
Number Of Lines (input / Output)
8 / 3
Output Type
3-State
Propagation Delay Time
20 ns at 5 V
Logical Function
Buffer/Line Driver
Number Of Elements
2
Number Of Channels
8
Number Of Inputs
8
Number Of Outputs
8
Operating Supply Voltage (typ)
5V
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
4.5V
Quiescent Current
4uA
Technology
CMOS
Pin Count
20
Mounting
Through Hole
Operating Temp Range
-55C to 125C
Operating Temperature Classification
Military
Logic Device Type
Buffer, Non Inverting
Supply Voltage Range
4.5V To 5.5V
Logic Case Style
DIP
No. Of Pins
20
Operating Temperature Range
-55°C To +125°C
Filter Terminals
DIP
Rohs Compliant
Yes
Breakdown Voltage
24V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
MC74HCT244ANGOS
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
*These packages are inherently Pb−Free.
ORDERING INFORMATION
Specifications Brochure, BRD8011/D.
20
MC74HCT244AN
MC74HCT244ANG
MC74HCT244ADW
MC74HCT244ADWG
MC74HCT244ADWR2
MC74HCT244ADWR2G
MC74HCT244ADTR2
MC74HCT244ADTR2G
MC74HCT244AF
MC74HCT244AFG
MC74HCT244AFEL
MC74HCT244AFELG
1
MC74HCT244AN
AWLYYWWG
PDIP−20
Device
20
1
(Note: Microdot may be in either location)
SOIC−20W
AWLYYWWG
HCT244A
A
WL, L
YY, Y
WW, W = Work Week
G or G
MARKING DIAGRAMS
http://onsemi.com
MC74HCT244A
= Assembly Location
= Wafer Lot
= Year
= Pb−Free Package
TSSOP−20*
TSSOP−20*
SOEIAJ−20
SOEIAJ−20
SOEIAJ−20
SOEIAJ−20
(Pb−Free)
(Pb−Free)
(Pb−Free)
(Pb−Free)
(Pb−Free)
Package
SOIC−20
SOIC−20
SOIC−20
SOIC−20
PDIP−20
PDIP−20
5
20
1
TSSOP−20
ALYWG
244A
HCT
G
1000 / Tape & Reel
2500 / Tape & Reel
2000 / Tape & Reel
18 Units / Rail
38 Units / Rail
40 Units / Rail
20
1
Shipping
SOEIAJ−20
74HCT244A
AWLYWWG

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