MC74HCT244ANG ON Semiconductor, MC74HCT244ANG Datasheet - Page 7

• Manufacturer Part Number: MC74HCT244ANG
• Description: IC BUFF/DVR/RCVR 3ST DUAL 20DIP
• Manufacturer: ON Semiconductor
• Series: 74HCTr

Specifications of MC74HCT244ANG

• Logic Type: Buffer/Line Driver, Non-Inverting
• Number Of Elements: 2
• Number Of Bits Per Element: 4
• Current - Output High, Low: 6mA, 6mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: 20-DIP (0.300", 7.62mm)
• Circuit Type: Low-Power Schottky
• Current, Supply: 160 μA
• Function Type: 8-Channels
• Logic Function: Buffer/Driver/Receiver
• Number Of Circuits: Octal
• Package Type: PDIP-20
• Special Features: Non-Inverting, Tri-State
• Temperature, Operating, Range: -55 to +125 °C
• Voltage, Supply: 4.5 to 5.5 V
• Logic Family: HCT
• Number Of Channels Per Chip: 8
• Polarity: Non-Inverting
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 4.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: Through Hole
• High Level Output Current: - 6 mA
• Low Level Output Current: 6 mA
• Maximum Power Dissipation: 750 mW
• Minimum Operating Temperature: - 55 C
• Number Of Lines (input / Output): 8 / 3
• Output Type: 3-State
• Propagation Delay Time: 20 ns at 5 V
• Logical Function: Buffer/Line Driver
• Number Of Elements: 2
• Number Of Channels: 8
• Number Of Inputs: 8
• Number Of Outputs: 8
• Operating Supply Voltage (typ): 5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 4.5V
• Quiescent Current: 4uA
• Technology: CMOS
• Pin Count: 20
• Mounting: Through Hole
• Operating Temp Range: -55C to 125C
• Operating Temperature Classification: Military
• Logic Device Type: Buffer, Non Inverting
• Supply Voltage Range: 4.5V To 5.5V
• Logic Case Style: DIP
• No. Of Pins: 20
• Operating Temperature Range: -55°C To +125°C
• Filter Terminals: DIP
• Rohs Compliant: Yes
• Breakdown Voltage: 24V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: MC74HCT244ANGOS

0.15 (0.006) T
0.15 (0.006) T
L
2X
−T−
U
PIN 1
IDENT
U
L/2
C
0.100 (0.004)
S
S
SEATING
PLANE
20
1
D
0.36
16X
20X
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
−V−
0.10 (0.004)
A
K
REF
G
H
M
10
11
PACKAGE DIMENSIONS
T
SOLDERING FOOTPRINT*
1
1.26
16X
U
http://onsemi.com
−U−
MC74HCT244A
S
B
CASE 948E−02
DT SUFFIX
V
TSSOP−20
ISSUE C
S
7.06
N
7
J J1
N
DETAIL E
Í Í Í Í
Í Í Í Í
Í Í Í Í
DETAIL E
SECTION N−N
F
0.25 (0.010)
DIMENSIONS: MILLIMETERS
K1
K
M
−W−
NOTES:
0.65
PITCH
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION:
3. DIMENSION A DOES NOT INCLUDE
4. DIMENSION B DOES NOT INCLUDE
5. DIMENSION K DOES NOT INCLUDE
6. TERMINAL NUMBERS ARE SHOWN FOR
7. DIMENSION A AND B ARE TO BE
ANSI Y14.5M, 1982.
MILLIMETER.
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
REFERENCE ONLY.
DETERMINED AT DATUM PLANE −W−.
DIM
J1
K1
M
A
B
C
D
F
G
H
K
L
J
MILLIMETERS
MIN
6.40
4.30
0.05
0.50
0.27
0.09
0.09
0.19
0.19
−−−
0
0.65 BSC
6.40 BSC
_
MAX
6.60
4.50
1.20
0.15
0.75
0.37
0.20
0.16
0.30
0.25
8
_
0.252
0.169
0.002
0.020
0.004
0.004
0.007
0.007
0.011
MIN
−−−
0
0.026 BSC
0.252 BSC
_
INCHES
0.260
0.177
0.047
0.006
0.030
0.015
0.008
0.006
0.012
0.010
MAX
8
_