74ACT541SCX Fairchild Semiconductor, 74ACT541SCX Datasheet - Page 9
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74ACT541SCX
Manufacturer Part Number
74ACT541SCX
Description
IC BUFF/DVR TRI-ST 8BIT 20SOIC
Manufacturer
Fairchild Semiconductor
Series
74ACTr
Datasheet
1.74ACT541MTCX.pdf
(11 pages)
Specifications of 74ACT541SCX
Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
1
Number Of Bits Per Element
8
Current - Output High, Low
24mA, 24mA
Voltage - Supply
4.5 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
20-SOIC (7.5mm Width)
Logic Family
74ACT
Number Of Channels Per Chip
Octal
Polarity
Non-Inverting
Supply Voltage (max)
5.5 V
Supply Voltage (min)
4.5 V
Maximum Operating Temperature
85 C
Mounting Style
SMD/SMT
High Level Output Current
- 24 mA
Input Bias Current (max)
4 uA
Low Level Output Current
24 mA
Minimum Operating Temperature
- 40 C
Number Of Lines (input / Output)
3
Output Type
3-State
Propagation Delay Time
7 ns @ 5 V
Logical Function
Buffer/Line Driver
Number Of Elements
1
Number Of Channels
8
Number Of Inputs
8
Number Of Outputs
8
Operating Supply Voltage (typ)
5V
Package Type
SOIC W
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
4.5V
Quiescent Current
4uA
Technology
CMOS
Pin Count
20
Mounting
Surface Mount
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
74ACT541SCX
Manufacturer:
FAIRCHILD/仙童
Quantity:
20 000
©1988 Fairchild Semiconductor Corporation
74AC541, 74ACT541 Rev. 1.5.0
Physical Dimensions
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
Figure 3. 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
(Continued)
9
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