74HCT1G126GW,125 NXP Semiconductors, 74HCT1G126GW,125 Datasheet
74HCT1G126GW,125
Specifications of 74HCT1G126GW,125
74HCT1G126GW-G
935245700125
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74HCT1G126GW,125 Summary of contents
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Bus buffer/line driver; 3-state Rev. 04 — 20 July 2007 1. General description The 74HC1G126 and 74HCT1G126 are high-speed, Si-gate CMOS devices. They provide one non-inverting buffer/line driver with 3-state output. The 3-state output is controlled by the ...
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... NXP Semiconductors 5. Functional diagram mna125 Fig 1. Logic symbol 6. Pinning information 6.1 Pinning Fig 4. Pin configuration 6.2 Pin description Table 3. Pin description Symbol Pin GND Functional description Table 4. Function table H = HIGH voltage level LOW voltage level don’t care high-impedance OFF-state ...
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... NXP Semiconductors 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter V supply voltage CC I input clamping current IK I output clamping current OK I output current O I supply current CC I ground current ...
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... NXP Semiconductors Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V). All typical values are measured at T Symbol Parameter V HIGH-level output OH voltage V LOW-level output OL voltage I input leakage current I I OFF-state output OZ current I supply current CC C input capacitance I For type 74HCT1G126 V HIGH-level input ...
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... NXP Semiconductors 11. Dynamic characteristics Table 8. Dynamic characteristics GND = 6.0 ns unless otherwise specified. All typical values are measured circuit see Figure 7 Symbol Parameter Conditions For type 74HC1G126 t propagation delay see enable time see disable time see dis power dissipation V = GND capacitance ...
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... NXP Semiconductors 12. Waveforms Measurement points are given in Fig 5. The input (A) to output (Y) propagation delays OE input output LOW-to-OFF OFF-to-LOW output HIGH-to-OFF OFF-to-HIGH Measurement points are given in Fig 6. The 3-state enable and disable times Table 9. Measurement points Type Input V M 74HC1G126 0.5 74HCT1G126 1 ...
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... NXP Semiconductors GENERATOR Test data is given in Table 8. Definitions for test circuit Termination resistance should be equal to the output impedance Load capacitance including jig and probe capacitance Load resistance L For open PLH PHL 1 For PLZ PZL 1 CC For GND PHZ PZH 1 Fig 7. Load circuitry for switching times ...
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... NXP Semiconductors 13. Package outline TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1. DIMENSIONS (mm are the original dimensions UNIT max. 0.1 1.0 mm 1.1 0.15 0 0.8 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION IEC SOT353-1 Fig 8 ...
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... NXP Semiconductors Plastic surface-mounted package; 5 leads DIMENSIONS (mm are the original dimensions UNIT 0.100 0.40 1.1 0.26 mm 0.013 0.25 0.9 0.10 OUTLINE VERSION IEC SOT753 Fig 9. Package outline SOT753 (SC-74A) 74HC_HCT1G126_4 Product data sheet 74HC1G126; 74HCT1G126 scale 3.1 1.7 3.0 0.6 0.95 2 ...
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... Release date 74HC_HCT1G126_4 20070720 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Package SOT353 changed to SOT353-1 in • ...
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... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...
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... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 7 Functional description . . . . . . . . . . . . . . . . . . . 2 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 14 Abbreviations ...