74LVC827ADB,118 NXP Semiconductors, 74LVC827ADB,118 Datasheet - Page 2
![IC BUFF DVR TRI-ST 10BIT 24SSOP](/photos/6/52/65222/568-24-ssop_sot340-1_sml.jpg)
74LVC827ADB,118
Manufacturer Part Number
74LVC827ADB,118
Description
IC BUFF DVR TRI-ST 10BIT 24SSOP
Manufacturer
NXP Semiconductors
Series
74LVCr
Datasheet
1.74LVC827APW118.pdf
(17 pages)
Specifications of 74LVC827ADB,118
Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
1
Number Of Bits Per Element
10
Current - Output High, Low
24mA, 24mA
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
24-SSOP
Logic Family
LVC
Number Of Channels Per Chip
10
Polarity
Non-Inverting
Supply Voltage (max)
3.6 V
Supply Voltage (min)
1.2 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
High Level Output Current
- 24 mA
Low Level Output Current
24 mA
Minimum Operating Temperature
- 40 C
Number Of Lines (input / Output)
10 / 10
Output Type
3-State
Propagation Delay Time
10 ns at 1.2 V, 2.8 ns at 3.3 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
74LVC827ADB-T
74LVC827ADB-T
935262419118
74LVC827ADB-T
935262419118
Philips Semiconductors
4. Ordering information
Table 2:
9397 750 13037
Product data sheet
Type number
74LVC827AD
74LVC827ADB
74LVC827APW
Ordering information
Package
Temperature range Name
40 C to +125 C
40 C to +125 C
40 C to +125 C
Table 1:
GND = 0 V; T
[1]
[2]
Symbol
C
PD
C
P
f
f
C
V
N = total load switching outputs;
The condition is V
i
o
(C
D
CC
PD
= input frequency in MHz;
L
= output frequency in MHz;
= output load capacitance in pF;
= C
L
is used to determine the dynamic power dissipation (P
= supply voltage in V;
PD
V
Quick reference data
CC
Parameter
power dissipation
capacitance per buffer
amb
2
V
CC
SO24
SSOP24
TSSOP24
= 25 C; t
f
o
2
) = sum of the outputs.
I
= GND to V
f
i
10-bit buffer/line driver with 5 V tolerant inputs/outputs; 3-state
N + (C
Rev. 02 — 8 April 2004
r
= t
Description
plastic small outline package; 24 leads; body width
7.5 mm
plastic shrink small outline package; 24 leads; body
width 5.3 mm
plastic thin shrink small package outline package; 24
leads; body width 4.4 mm
f
L
CC
2.5 ns.
.
V
…continued
CC
2
f
Conditions
V
o
) where:
CC
outputs enabled
outputs disabled
= 3.3 V
D
in W).
[1] [2]
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Min
-
-
74LVC827A
Typ
12
3
Max
-
-
Version
SOT137-1
SOT340-1
SOT355-1
Unit
pF
pF
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