74LVC2244ABQ,115 NXP Semiconductors, 74LVC2244ABQ,115 Datasheet - Page 14

• Manufacturer Part Number: 74LVC2244ABQ,115
• Description: IC BUFF/DVR TRI-ST QUAD 20QFN
• Manufacturer: NXP Semiconductors
• Series: 74LVCr

Specifications of 74LVC2244ABQ,115

• Logic Type: Buffer/Line Driver, Non-Inverting
• Number Of Elements: 4
• Number Of Bits Per Element: 4
• Current - Output High, Low: 12mA, 12mA
• Voltage - Supply: 1.2 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 20-VQFN Exposed Pad, 20-HVQFN, 20-SQFN, 20-DHVQFN
• Logic Family: LVC
• Number Of Channels Per Chip: 8
• Polarity: Non-Inverting
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 1.2 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• High Level Output Current: - 12 mA
• Low Level Output Current: 12 mA
• Minimum Operating Temperature: - 40 C
• Number Of Lines (input / Output): 8 / 8
• Output Type: 3-State
• Propagation Delay Time: 35 ns at 1.2 V, 3.8 ns at 2.7 V, 3.1 ns at 3 V to 3.6 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 74LVC2244ABQ-G; 74LVC2244ABQ-G; 935273000115

Philips Semiconductors
2004 Apr 07
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
Octal buffer/line driver; with 30
resistors; 5 V tolerant input/output; 3-state
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT360-1
max.
1.1
A
0.15
0.05
A
1
20
1
Z
y
0.95
0.80
A
2
pin 1 index
IEC
0.25
A
3
e
D
0.30
0.19
b
p
MO-153
JEDEC
0.2
0.1
c
b
p
REFERENCES
D
6.6
6.4
0
(1)
11
10
w
E
series termination
4.5
4.3
M
(2)
JEITA
scale
2.5
0.65
14
e
c
A
H
6.6
6.2
2
E
A
1
5 mm
L
1
0.75
0.50
L
H
p
E
E
detail X
0.4
0.3
Q
L
L
PROJECTION
EUROPEAN
p
0.2
v
Q
A
(A )
0.13
3
w
74LVC2244A
X
Product specification
v
0.1
A
y
M
ISSUE DATE
A
99-12-27
03-02-19
Z
0.5
0.2
(1)
SOT360-1
8
0
o
o