74ABT827DB,118 NXP Semiconductors, 74ABT827DB,118 Datasheet

IC BUFF DVR TRI-ST 10BIT 24SSOP

74ABT827DB,118

Manufacturer Part Number
74ABT827DB,118
Description
IC BUFF DVR TRI-ST 10BIT 24SSOP
Manufacturer
NXP Semiconductors
Series
74ABTr
Datasheet

Specifications of 74ABT827DB,118

Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
1
Number Of Bits Per Element
10
Current - Output High, Low
32mA, 64mA
Voltage - Supply
4.5 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
24-SSOP
Logic Family
ABT
Number Of Channels Per Chip
10
Polarity
Non-Inverting
Supply Voltage (max)
5.5 V
Supply Voltage (min)
4.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
High Level Output Current
- 32 mA
Low Level Output Current
64 mA
Minimum Operating Temperature
- 40 C
Number Of Lines (input / Output)
10 / 10
Output Type
3-State
Propagation Delay Time
4.4 ns at 5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
74ABT827DB-T
74ABT827DB-T
935069210118
1. General description
2. Features and benefits
3. Ordering information
Table 1.
Type number
74ABT827D
74ABT827DB
74ABT827PW
Ordering information
Package
Temperature range Name
−40 °C to +85 °C
−40 °C to +85 °C
−40 °C to +85 °C
The 74ABT827 high-performance BiCMOS device combines low static and dynamic
power dissipation with high speed and high output drive.
The 74ABT827 10-bit buffers provide high performance bus interface buffering for wide
data/address paths or buses carrying parity. They have NOR Output Enables (OE0, OE1)
for maximum control flexibility.
74ABT827
10-bit buffer/line driver; non-inverting; 3-state
Rev. 04 — 1 April 2010
Ideal where high speed, light loading, or increased fan-in are required
Flow-through pinout architecture for microprocessor oriented applications
Output capability: +64 mA and −32 mA
Power-up 3-state
Inputs are disabled during 3-state mode
Latch-up protection exceeds 500 mA per JESD78B class II level A
ESD protection:
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V
SO24
SSOP24
TSSOP24
Description
plastic small outline package; 24 leads; body width
7.5 mm
plastic shrink small outline package; 24 leads; body
width 5.3 mm
plastic thin shrink small outline package; 24 leads;
body width 4.4 mm
Product data sheet
Version
SOT137-1
SOT340-1
SOT355-1

Related parts for 74ABT827DB,118

74ABT827DB,118 Summary of contents

Page 1

Rev. 04 — 1 April 2010 1. General description The 74ABT827 high-performance BiCMOS device combines low static and dynamic power dissipation with high speed and high output drive. The 74ABT827 10-bit buffers provide high ...

Page 2

... NXP Semiconductors 4. Functional diagram OE0 13 OE1 Fig 1. Logic symbol A0 1 OE0 13 OE1 Y0 Fig 3. Logic diagram 74ABT827_4 Product data sheet 001aae885 Fig All information provided in this document is subject to legal disclaimers. Rev. 04 — 1 April 2010 74ABT827 10-bit buffer/line driver; non-inverting; 3-state 1 & EN1 ...

Page 3

... NXP Semiconductors 5. Pinning information 5.1 Pinning Fig 4. Pin configuration 5.2 Pin description Table 2. Pin description Symbol Pin OE0 10, 11 GND 12 OE1 23, 22, 21, 20, 19, 18, 17, 16, 15 Functional description 6.1 Function table [1] Table 3. Function table Inputs OEn [ HIGH voltage level LOW voltage level; ...

Page 4

... NXP Semiconductors 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V supply voltage CC V input voltage I V output voltage O I input clamping current IK I output clamping current OK I output current O T junction temperature j T storage temperature ...

Page 5

... NXP Semiconductors 9. Static characteristics Table 6. Static characteristics Symbol Parameter V input clamping voltage IK V HIGH-level output OH voltage V LOW-level output OL voltage I input leakage current I I power-off leakage OFF current I power-up/power-down O(pu/pd) output current I OFF-state output current output leakage current LO I output current O I supply current CC Δ ...

Page 6

... NXP Semiconductors 10. Dynamic characteristics Table 7. Dynamic characteristics GND = 0 V; for test circuit, see Figure Symbol Parameter t LOW to HIGH propagation delay PLH t HIGH to LOW propagation delay PHL t OFF-state to HIGH propagation delay OEn to Yn; see PZH t OFF-state to LOW propagation delay OEn to Yn; see ...

Page 7

... NXP Semiconductors OEn input output LOW-to-OFF OFF-to-LOW output HIGH-to-OFF OFF-to-HIGH and V are typical voltage output levels that occur with the output load Fig 6. 3-state enable and disable times negative V M pulse positive V M pulse Input pulse definition Test data and V ...

Page 8

... NXP Semiconductors 12. Package outline SO24: plastic small outline package; 24 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.3 2.45 mm 2.65 0.25 0.1 2.25 0.012 0.096 inches 0.1 0.01 0.004 0.089 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...

Page 9

... NXP Semiconductors SSOP24: plastic shrink small outline package; 24 leads; body width 5 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.21 1. 0.25 0.05 1.65 Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION IEC SOT340-1 Fig 9. Package outline SOT340-1 (SSOP24) ...

Page 10

... NXP Semiconductors TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...

Page 11

... Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • DIP 24 (SOT222-1) package removed from 12 “Package outline” ...

Page 12

... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...

Page 13

... NXP Semiconductors 15.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 16. Contact information For more information, please visit: For sales office addresses, please send an email to: 74ABT827_4 Product data sheet 10-bit buffer/line driver; non-inverting; 3-state http://www ...

Page 14

... NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Functional description . . . . . . . . . . . . . . . . . . . 3 6.1 Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 12 Package outline ...

Related keywords