IXDN404 IXYS Corporation, IXDN404 Datasheet - Page 3

• Manufacturer Part Number: IXDN404
• Description: 4 Ampere Dual Low-Side Ultrafast MOSFET Drivers
• Manufacturer: IXYS Corporation

Thermal Resistance (Junction to Case)
Electrical Characteristics
Absolute Maximum Ratings
Specifications Subject To Change Without Notice
Note 1: Operating the device beyond parameters with listed “Absolute Maximum Ratings” may cause permanent
damage to the device. Typical values indicate conditions for which the device is intended to be functional, but do not
guarantee specific performance limits. The guaranteed specifications apply only for the test conditions listed.
Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
Unless otherwise noted, T
All voltage measurements with respect to GND. Device configured as described in Test Conditions. All specifications are for one channel.
Parameter
Supply Voltage
All Other Pins
Junction Temperature
Storage Temperature
Soldering Lead Temperature
(10 seconds maximum)
Symbol
V
V
V
I
V
V
R
R
I
I
t
t
t
t
V
I
8 Pin SOIC (SI)
16 Pin SOIC (SI-16)
IN
PEAK
DC
R
F
ONDLY
OFFDLY
CC
IH
IL
IN
OH
OL
CC
OH
OL
Parameter
High input voltage
Low input voltage
Input voltage range
Input current
High output voltage
Low output voltage
Output resistance
@ Output High
Output resistance
@ Output Low
Peak output current
Continuous output
current
Rise time
Fall time
On-time propagation
delay
Off-time propagation
delay
Power supply voltage
Power supply current
A
= 25
o
C, 4.5V ≤ V
Value
40V
-0.3V to V CC + 0.3V
150 o C
-65 o C to 150 o C
300 o C
10 K/W
10 K/W
(Note 1)
(
CC
θ
JC
≤ 35V .
)
Test Conditions
4.5V ≤ V
4.5V ≤ V
0V ≤ V
V
V
V
C
C
C
C
V
V
V
CC
CC
CC
IN
IN
IN
L
L
L
L
=1800pF Vcc=18V
=1800pF Vcc=18V
=1800pF Vcc=18V
=1800pF Vcc=18V
= + V
= 3.5V
= 0V
= 18V
= 18V
= 18V
IN
CC
CC
≤ V
CC
≤ 18V
≤ 18V
CC
3
Operating Temperature Range
Thermal Resistance (To Ambient)
θ
Heat sink area of 1 cm
Heat sink area of 3 cm
**
Operating Ratings
JA
8 Pin PDIP (PI) (θ
8 Pin SOIC
Parameter
8 Pin SOIC (SIA)
16 Pin SOIC (SIA-16) (θ
with heat sink **
16 Pin SOIC-CT
8 Pin SOIC
16 Pin SOIC-CT
Device soldered to metal back pane. Heat sink area is 1 oz.
copper on 1 side of 0.06" thick FR4 PC board.
V
CC
JA
Min
)
2.5
-10
4.5
- 0.025
-5
2
2
IXDN404 / IXDI404 / IXDF404
JA
)
Typ
1.5
16
13
36
35
18
2
4
1
0
V
120 K/W
110 K/W
110 K/W
95 K/W
-55 o C to 125 o C
95 K/W
85 K/W
85 K/W
Value
CC
0.025
Max
0.8
2.5
10
35
10
10
18
17
40
39
2
1
3
+ 0.3
Units
mA
µA
µA
µA
ns
ns
ns
ns
Ω
Ω
V
V
V
V
V
A
A
V