CMH08A TOSHIBA Semiconductor CORPORATION, CMH08A Datasheet
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CMH08A
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CMH08A Summary of contents
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... R th (j-a) (soldering land × 6 mm) (board thickness: 1.6 t) Device mounted on a glass-epoxy board (board size × 50 mm) (soldering land: 2.1 mm × 1.4 mm) (board thickness: 1.6 t) ⎯ (j-ℓ) 1 CMH08A JEDEC ― JEITA ― TOSHIBA 3-4E1A Weight: 0.023 g (typ.) Min Typ. ...
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... We recommend that a device be used Tj of below 120℃ under the worst load and heat radiation conditions. Thermal resistance between junction and ambient fluctuates depending on device’s mounting condition. When using a device, please design a circuit board and a soldering land size to match the appropriate thermal resistance value. Please refer to Rectifier databook for further information. Unit: mm 1.4 2 CMH08A 2006-11-08 ...
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... Soldering land: 6.0 mm × 6.0 mm board thickness: 1.6 t Device mounted on a ceramic board: board size × Soldering land: 2.0 mm × 2.0 mm board thickness: 0.64 t 0.1 0 Time t (s) 3 CMH08A P – (AV) F (AV) 0.8 1.2 1.6 2.0 2.4 2.8 (A) F (AV) Ta max – (AV) Device mounted on a glass-epoxy board: board size × ...
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... C – 100 Ta = 25° MHz Reverse voltage V (V) R (Typ 100 4 CMH08A Surge forward current (non-repetitive 25° 100 Number of cycles 2006-11-08 ...
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... Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 5 CMH08A 20070701-EN 2006-11-08 ...