HY27SF082G2B Hynix Semiconductor, HY27SF082G2B Datasheet - Page 19

no-image

HY27SF082G2B

Manufacturer Part Number
HY27SF082G2B
Description
2gb Nand Flash
Manufacturer
Hynix Semiconductor
Datasheet
Rev 0.3 / Feb. 2008
Operating
Current
Stand-by Current (TTL)
Stand-by Current (CMOS)
Input Leakage Current
Output Leakage Current
Input High Voltage
Input Low Voltage
Output High Voltage Level
Output Low Voltage Level
Output Low Current (R/B)
Input Pulse Levels
Input Rise and Fall Times
Input and Output Timing Levels
Output Load (1.7V - 1.95V)
Parameter
Sequential
Read
Program
Erase
Parameter
Table 9: DC and Operating Characteristics
Symbol
(R/B)
I
I
I
I
I
V
V
V
I
V
I
I
CC1
CC2
CC3
CC4
CC5
LO
OL
OH
LI
OL
IH
IL
Table 10: AC Conditions
2Gbit (256Mx8bit/128Mx16bit) NAND Flash
V
V
CE=V
OUT
Test Conditions
IN=
CE=Vcc-0.2,
I
WP=0V/Vcc
WP=0V/Vcc
=0 to Vcc (max)
I
OH
0 to Vcc (max)
V
t
OL
CE=V
RC
IL
OL
=-100uA
=100uA
, I
=45ns
=0.2V
-
-
-
-
OUT
IH
=0mA
,
HY27SF(08/16)2G2B Series
0.8xVcc
Vcc-0.1
Min
1 TTL GATE and CL=30pF
-0.3
3
-
-
-
-
-
-
-
-
0V to VCC
1.8Volt
1.8Volt
Value
VCC/2
5ns
Typ
10
10
10
10
4
-
-
-
-
-
-
Vcc+0.3
0.2xVcc
Max
± 10
± 10
20
20
20
50
1
1
-
-
Unit
mA
mA
mA
mA
mA
uA
uA
uA
V
V
V
V
19

Related parts for HY27SF082G2B