MPC875 Freescale Semiconductor, Inc, MPC875 Datasheet - Page 79

• Manufacturer Part Number: MPC875
• Description: Mpc875 Powerquicc Integrated Communications Processor
• Manufacturer: Freescale Semiconductor, Inc

16.2
Figure 70
Freescale Semiconductor
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Figure 70. Mechanical Dimensions and Bottom Surface Nomenclature of the PBGA Package
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M—1994.
3. MAXIMUM SOLDER BALL DIAMETER MEASURED PARALLEL TO DATUM A.
4. DATUM A, THE SEATING PLANE, IS DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.
Note:
NOTES:
Mechanical Dimensions of the PBGA Package
shows the mechanical dimensions of the PBGA package.
Solder sphere composition is 95.5%Sn 45%Ag 0.5%Cu for MPC875/MPC870VRXXX.
Solder sphere composition is 62%Sn 36%Pb 2%Ag for MPC875/MPC870ZTXXX.
MPC875/MPC870 PowerQUICC™ Hardware Specifications, Rev. 4
Mechanical Data and Ordering Information
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