DS32C35 Maxim Integrated Products, Inc., DS32C35 Datasheet - Page 21

• Manufacturer Part Number: DS32C35
• Description: Accurate I2c Rtc With Integrated Tcxo/crystal/fram
• Manufacturer: Maxim Integrated Products, Inc.

SUBSTRATE CONNECTED TO GROUND
PROCESS: CMOS
TOP VIEW
INT/SQW
32kHz
N.C.
N.C.
N.C.
N.C.
N.C.
V
RST
WP
CC
V
CPU
CC
10
1
2
3
4
5
6
7
8
9
DS32B35/
DS32C35
SO
PUSHBUTTON
Pin Configuration
Chip Information
RESET
R
PU
Accurate I
= t
20
19
18
17
16
15
14
13
12
11
R
/C
____________________________________________________________________
SCL
GND
SCL
SDA
V
GND
N.C.
N.C.
N.C.
N.C.
B
BAT
R
PU
V
CC
R
PU
RST
N.C.
N.C.
N.C.
N.C.
SCL
SCL
SDA
WP
N.C.
2
DS32B35/
DS32C35
Theta-JA: +73°C/W
Theta-JC: +23°C/W
For the latest package outline information, go to
www.maxim-ic.com/DallasPackInfo.
# Denotes a RoHS-compliant device that may include lead that
is exempt under RoHS requirements. The lead finish is JESD97
category e3, and is compatible with both lead-based and lead-
free soldering processes. A "#" anywhere on the top mark
denotes a RoHS-compliant device.
†
device.
An “N” anywhere on the top mark denotes an industrial grade
GND
C RTC with Integrated
V
V
PACKAGE TYPE
DS32B35-33#
DS32B35-33IND#
DS32C35-33#
DS32C35-33IND#
20 SO (300 mils)
CC
CC
PART
TCXO/Crystal/FRAM
INT/SQW
32kHz
V
GND
N.C.
N.C.
N.C.
N.C.
BAT
Typical Operating Circuit
PACKAGE CODE
Thermal Information
FRAM DENSITY
Package Information
2k x 8
2k x 8
8k x 8
8k x 8
—
Selector Guide
DOCUMENT NO.
56-G4009-001
DS32B35
DS32B35
DS32C35
DS32C35
MARK
TOP
†
21