BLF1822-10 NXP Semiconductors, BLF1822-10 Datasheet - Page 3

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BLF1822-10

Manufacturer Part Number
BLF1822-10
Description
Uhf Power Ldmos Transistor
Manufacturer
NXP Semiconductors
Datasheet

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Philips Semiconductors
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
THERMAL CHARACTERISTICS
Note
1. Thermal resistance is determined under RF operating conditions.
CHARACTERISTICS
T
2003 Feb 10
V
V
I
T
T
R
R
V
V
I
I
I
g
R
C
C
C
D
j
DSS
DSX
GSS
fs
stg
j
SYMBOL
SYMBOL
DS
GS
(BR)DSS
GSth
th j-mb
th mb-h
= 25 C unless otherwise specified.
DSon
is
os
rs
UHF power LDMOS transistor
SYMBOL
thermal resistance from junction to mounting base
thermal resistance from mounting base to heatsink
drain-source breakdown voltage
gate-source threshold voltage
drain-source leakage current
on-state drain current
gate leakage current
forward transconductance
drain-source on-state resistance
input capacitance
output capacitance
feedback capacitance
drain-source voltage
gate-source voltage
drain current (DC)
storage temperature
junction temperature
PARAMETER
PARAMETER
PARAMETER
V
V
V
V
V
V
V
V
V
V
GS
DS
GS
GS
GS
DS
GS
GS
GS
GS
= 0; I
= 10 V; I
= 0; V
= V
= 15 V; V
= 10 V; I
= 10 V; I
= 0; V
= 0; V
= 0; V
3
GSth
CONDITIONS
D
DS
DS
DS
DS
= 0.2 mA
+ 9 V; V
D
D
D
= 26 V
= 26 V; f = 1 MHz
= 26 V; f = 1 MHz
= 26 V; f = 1 MHz
= 20 mA
= 0.75 A
= 0.75 A
DS
T
mb
= 0
DS
= 25 C; note 1
CONDITIONS
= 10 V
65
MIN.
65
4
2.8
MIN.
0.5
1.2
13
11
0.5
65
2.2
+150
200
TYP.
VALUE
15
MAX.
BLF1822-10
Product specification
0.5
5
5
1.5
40
MAX.
V
V
A
C
C
UNIT
UNIT
K/W
K/W
V
V
A
nA
S
pF
pF
pF
UNIT
A

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