D15 STMicroelectronics, D15 Datasheet - Page 8

• Manufacturer Part Number: D15
• Description: Memory Micromodules General Information for D1/ D2 and C Packaging
• Manufacturer: STMicroelectronics

Package Outline
SONY CODE
JEDEC CODE
EIAJ CODE
0.65
20
1
0.575 MAX
0.22 – 0.05
Unit: mm
6.5 ± 0.1
+ 0.1
SSOP020-P-0044-AN
SSOP-20P-L071
10
11
20PIN SSOP (Plastic)
0.10 M
NOTE: Dimension “ ” does not include mold protrusion.
– 8 –
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
0° to 10°
SOLDER PLATING
Cu ALLOY
EPOXY RESIN
0.1g
0.1 ± 0.1
0.10
CXD1267AN