S3038 AMCC (Applied Micro Circuits Corp), S3038 Datasheet - Page 7
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S3038
Manufacturer Part Number
S3038
Description
Sonet/sdh/atm OC-12 Quad Transceiver
Manufacturer
AMCC (Applied Micro Circuits Corp)
Datasheet
1.S3038.pdf
(13 pages)
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April 4, 2000 / Revision D
Figure 6. 32 TQFP Package
Note: The S3040 package is equipped with an embedded conductive heatsink on the bottom (board side). Active circuitry and vias should not
appear in the area immediately under the package. This heatsink is electrically biased to the VEE potential of the S3040. For optimum thermal
management, a foil surface at ground (or VEE if other than ground) is recommended immediately under the package, and connected with
multiple vias to the internal plane(s) of similar potential. Thermally conductive epoxy or other conductive interposer can be used to establish a
good thermal dissipation path.
SONET/SDH CLOCK RECOVERY UNIT
Thermal Management
TOP VIEW
D
S
e
3
v
0
c i
4
0
e
3
s
˚ 6
o
d l
/ C
e
e r
W
d
i w
o t
h t
g
a j
o r
h
e
u
a
n
s t
d
n i
p
k
a l
n
e
BOTTOM VIEW
˚ 2
/ C
c j
W
CONNECTED
TO VEE
S3040A
7