FT221XQ-R International Semiconductor Technologies, FT221XQ-R Datasheet - Page 42

• Manufacturer Part Number: FT221XQ-R
• Description: Specifications: Applications: * ; Interface: * ; Voltage - Supply: 3.3 V ~ 5 V ; Package / Case: 20-VFQFN Exposed Pad ; Packaging: Digi-Reel
• Manufacturer: International Semiconductor Technologies

10.5 Solder Reflow Profile
The FT221X is supplied in Pb free 20 LD SSOP and QFN-20 packages. The recommended solder reflow
profile for both package options is shown in Figure 10.5.
Figure 10.5 FT221X Solder Reflow Profile
The recommended values for the solder reflow profile are detailed in Table 10.1. Values are shown for
both a completely Pb free solder process (i.e. the FT221X is used with Pb free solder), and for a non-Pb
free solder process (i.e. the FT221X is used with non-Pb free solder).
Table 10.1 Reflow Profile Parameter Values
Time Maintained Above Critical Temperature
Time within 5°C of actual Peak Temperature
25
Time for T= 25°C to Peak Temperature, T
T
T
p
L
T Max
T Min
S
S
Average Ramp Up Rate (T
- Temperature Max (T
- Temperature Min (T
- Time (t
Peak Temperature (T
- Temperature (T
Profile Feature
Ramp Down Rate
- Time (t
Preheat
s
Copyright © 2013 Future Technology Devices International Limited
Min to t
(t
T = 25º C to T
T
Preheat
Time, t (seconds)
L
p
:
)
t
S
L
)
s
Max)
s
s
L
)
Min.)
Max.)
P
s
p
)
to T
Ramp Up
p
)
p
Pb Free Solder Process
3°C / second Max.
60 to 120 seconds
60 to 150 seconds
6°C / second Max.
20 to 40 seconds
8 minutes Max.
t
p
150°C
200°C
217°C
260°C
t
L
Document No.: FT_000630 Clearance No.: FTDI# 263
Ramp
Down
Critical Zone: when
T is in the range
T to T
L
Non-Pb Free Solder Process
p
3°C / Second Max.
60 to 120 seconds
60 to 150 seconds
6°C / second Max.
20 to 40 seconds
6 minutes Max.
100°C
150°C
183°C
240°C
Version 1.2
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