STM915-16 ST Microelectronics, Inc., STM915-16 Datasheet - Page 5

• Manufacturer Part Number: STM915-16
• Description: RF Power Module GSM Mobile Applications . Linear Power Amplifier
• Manufacturer: ST Microelectronics, Inc.

APPLICATIONS RECOMMENDATIONS
OPERATION LIMITS
The STM915-16 power module should never be
operated under any condition which exceeds
the Absolute Maximum Ratings presented on
this data sheet. Nor should the module be
operated continuously at any of the specified
maximum ratings. If the module is to be
operated under any condition such that it may
be subjected to one or more of the maximum
rating conditions, care must be taken to monitor
other parameters which may be affected. For
example, a combination of high V
overdrive
maximum output power rating; in this condition,
the output power must be maintained below the
maximum rating by use of the gain control pin.
GAIN CONTROL
The module output power should be limited to
20 watts (43 dBm). The module is designed to
be operated with V
V
set to 1.0 mW (0 dBm). Module gain is adjusted
by varying V
DECOUPLING
The bypassing internal to the module is
sufficient for the frequency range 90-1300 MHz.
Care should be taken to insure proper
decoupling for each application as the module
is capable of a wide range of operating
characteristics including "linear" operation, in
which an important design criteria is the use of
appropriate bypassing. For bypassing low
frequencies while maintaining the electrical
specifications contained in this data sheet, use
of the decoupling network shown in the "Module
DC and Test Fixture Configuration" diagram
herein is recommended.
MODULE MOUNTING
To insure adequate thermal transfer from the
module to the heatsink, it is recommended that
a satisfactory thermal compound such as Dow
Corning 340, Wakefield 120-2 or equivalent be
applied between the module flange and the
heatsink.
S2
and V
S4
could
CONTROL
set to 12.5 Vdc and input power
result
S1
.
and V
in
S3
exceeding
set to 8.0 Vdc,
S3
and input
the
The heatsink mounting surface under the module
should be flat to within
The module should be mounted to the heatsink
using 3 mm (or 4-40) or equivalent screws
torqued to 5-6 kg-cm (4-6 in-lb).
The module leads are attached to the equipment
PC board using 180°C solder applied to the leads
with it properly grounded soldering iron trip, not to
exceed 195 C, applied a minimum of 2 mm
(0.080 inch) from the body of the module for a
duration not to exceed 15 seconds per lead. It is
imperative that no other portion of the module,
other
temperatures in excess of 100 C (maximum
storage temperature), for any period of time, as
the plastic moulded cover, internal components
and sealing adhesives may be adversely affected
by such conditions.
Due to the construction techniques and the
materials
soldering of the flange heatsink or leads, is not
recommended.
THERMAL CONSIDERATIONS
It will be necessary to provide a suitable heatsink
in
temperature at or below the maximum case
operating temperature. In a case where the
module output power will be limited to +42 dBm
(16 W) and designing for the worst case
efficiency of 35%, the power dissipated by the
module will be 29.7 watts. The heatsink must be
designed such that the thermal rise will be less
than the difference between the maximum
ambient temperature at which the module will
operate and the maximum operating case
temperature of the module while dissipating 29.7
watts.
order
than
used
to
the
maintain
within
leads,
0.05 mm ( 0.002 inch).
the
the
be
module,
module
subjected
STM915-16
reflow
flange
to
5/7