BGA7024,115 NXP Semiconductors, BGA7024,115 Datasheet
BGA7024,115
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BGA7024,115 Summary of contents
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BGA7024 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier Rev. 2 — 30 August 2010 1. Product profile 1.1 General description The BGA7024 MMIC is a one-stage amplifier, available in a low-cost surface-mount package. It delivers 24 ...
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... NXP Semiconductors 2. Pinning information Table 2. Pin [1] This pin is DC-coupled and requires an external DC-blocking capacitor. [2] The center metal base of the SOT89 also functions as heatsink for the power amplifier. 3. Ordering information Table 3. Type number BGA7024 4. Functional diagram Fig 1. BGA7024 Product data sheet 400 MHz to 2700 MHz 0 ...
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... NXP Semiconductors 5. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V RF supply voltage CC(RF input power i(RF) T case temperature case T junction temperature j V electrostatic discharge voltage ESD 6. Thermal characteristics Table 5. Symbol R th(j-c) 7. Static characteristics Table 6 ...
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... NXP Semiconductors Table 7. Input and output impedances matched to 50 Section 12 “Application Symbol Parameter IP3 out [1] Operation outside this range is possible but not guaranteed. [ dBm per tone; spacing = 1 MHz. L [3] Defined Scattering parameters Table 8. Scattering parameters MMIC only ...
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... NXP Semiconductors Table 8. Scattering parameters MMIC only f (MHz Magnitude Angle (ratio) (degree) 1800 0.90 148.7 1900 0.90 147.9 2000 0.91 147.5 2100 0.90 147 2200 0.90 146.9 2300 0.90 146.6 2400 0.90 146.5 2500 0.89 146.3 2600 0.88 146 2700 0.87 145.4 10. Reliability information Table 9. Life test Conditions HTOL 11 ...
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... NXP Semiconductors 12. Application information 12.1 920 MHz to 960 MHz Ω MSL1 MSL2 See Table 11 for a list of components. PCB specification: Rogers RO4003C; height = 0.508 mm; ε Fig application schematic; 920 MHz to 960 MHz 30 P L(1dB) (dBm 0.92 0.93 0.94 = −40 °C. (1) T case = 25 ° ...
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... NXP Semiconductors ISL in out (dB) −10 −20 −30 0.92 0.93 0. °C. T case ( (2) RL out (3) ISL Fig 5. Input return loss, output return loss and isolation as a function of frequency J1 MSL1 RF in See Table 11 for a list of components. Fig application reference board; 920 MHz to 960 MHz ...
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... NXP Semiconductors Table 11 application list of components; 920 MHz to 960 MHz See Figure 2 and Figure 7 for component layout. PCB: Rogers RO4003C stack; height = 0.508 mm; copper plating μ thickness = 35 m. Component Description C1, C5 capacitor C2 capacitor C3 capacitor C4 capacitor C6 capacitor C7 capacitor C8 capacitor C9 capacitor J1, J2 ...
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... NXP Semiconductors 30 P L(1dB) (dBm 1.93 1.95 = −40 °C. (1) T case = 25 °C. (2) T case = 85 °C. (3) T case Fig 9. Output power gain compression as a function of frequency ISL in out (dB) (1) −10 −20 (2) (3) −30 1.93 1. °C. T case ( (2) RL out (3) ISL Fig 11. Input return loss, output return loss and ...
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... NXP Semiconductors J1 MSL1 RF in See Table 12 for a list of components. Fig 13 application reference board; 1930 MHz to 1990 MHz BGA7024 Product data sheet 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier MSL4 MSL3 C5 MSL5 L1 C1 MSL2 All information provided in this document is subject to legal disclaimers ...
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... NXP Semiconductors Table 12 application list of components; 1930 MHz to 1990 MHz See Figure 8 and Figure 13 for component layout. PCB: Rogers RO4003C stack; height = 0.508 mm; copper plating μ thickness = 35 m. Component Description Value C1, C4 capacitor capacitor 2 capacitor 1 capacitor 15 pF ...
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... NXP Semiconductors 30 P L(1dB) (dBm 2.11 2.13 = −40 °C. (1) T case = 25 °C. (2) T case = 85 °C. (3) T case Fig 15. Output power gain compression as a function of frequency ISL in out (dB) −10 −20 −30 2.11 2. °C. T case ( (2) RL out (3) ISL Fig 17. Input return loss, output return loss and ...
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... NXP Semiconductors J1 MSL1 RF in See Table 13 for a list of components. Fig 19 application reference board; 2110 MHz to 2170 MHz BGA7024 Product data sheet 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier MSL4 MSL3 C5 MSL5 L1 C1 MSL2 All information provided in this document is subject to legal disclaimers ...
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... NXP Semiconductors Table 13 application list of components; 2110 MHz to 2170 MHz See Figure 14 and Figure 19 for component layout. PCB: Rogers RO4003C stack; height = 0.508 mm; copper plating μ thickness = 35 m. Component Description C1, C4 capacitor C2 capacitor C3 capacitor C5 capacitor C6 capacitor C7 capacitor J1 connector J3 DC connector ...
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... NXP Semiconductors 30 P L(1dB) (dBm 2.405 2.425 2.445 = −40 °C. (1) T case = 25 °C. (2) T case = 85 °C. (3) T case Fig 21. Output power gain compression as a function of frequency ISL in out (dB) −10 −20 −30 2.405 2.425 2.445 = 25 °C. T case (1) RL ...
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... NXP Semiconductors J1 MSL1 RF in See Table 14 for a list of components. Fig 25 application reference board; 2405 MHz to 2485 MHz BGA7024 Product data sheet 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier MSL4 MSL3 MSL2 All information provided in this document is subject to legal disclaimers. Rev. 2 — ...
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... NXP Semiconductors Table 14 application list of components; 2405 MHz to 2485 MHz See Figure 20 and Figure 25 for component layout. PCB: Rogers RO4003C stack; height = 0.508 mm; copper plating μ thickness = 35 m. Component Description C1, C4 capacitor C2 capacitor C3 capacitor C5 capacitor C6 capacitor C7 capacitor J1 connector J3 DC connector ...
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... NXP Semiconductors 12.5 PCB stack RF & analog routing RF & analog ground RF & analog ground (1) Pre-impregnated. Fig 26. PCB stack BGA7024 Product data sheet 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier through via analog routing RO4003C dielectric constant ε = 3.38. r All information provided in this document is subject to legal disclaimers. ...
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... NXP Semiconductors 13. Package outline Plastic surface-mounted package; exposed die pad for good heat transfer; 3 leads DIMENSIONS (mm are the original dimensions) UNIT 1.6 0.48 0.53 1.8 mm 1.4 0.35 0.40 1.4 OUTLINE VERSION IEC SOT89 Fig 27. Package outline SOT89 BGA7024 Product data sheet 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier ...
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... NXP Semiconductors 14. Abbreviations Table 15. Acronym CPE DC ESD HTOL ISM MMIC MoCA PCB RFID TX WLAN 15. Revision history Table 16. Revision history Document ID Release date BGA7024 v.2 20100830 • Modifications: • • • BGA7024 20100528 BGA7024 Product data sheet 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any 17. Contact information For more information, please visit: ...
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... NXP Semiconductors 18. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 3 9 Scattering parameters . . . . . . . . . . . . . . . . . . . . 4 10 Reliability information . . . . . . . . . . . . . . . . . . . . 5 11 Moisture sensitivity ...