MT55L128L32F1 Micron Semiconductor Products, Inc., MT55L128L32F1 Datasheet - Page 18

• Manufacturer Part Number: MT55L128L32F1
• Description: 4Mb ZBT SRAM, 3.3V Vdd, 3.3V or 2.5V I/O, Flow-Through,
• Manufacturer: Micron Semiconductor Products, Inc.

TQFP THERMAL RESISTANCE
FBGA THERMAL RESISTANCE
NOTE: 1. This parameter is sampled.
4Mb: 256K x 18, 128K x 32/36 Flow-Through ZBT SRAM
MT55L256L18F1_F.p65 – Rev. F, Pub. 1/03 EN
DESCRIPTION
Thermal Resistance
Thermal Resistance
(Junction to Top of Case)
DESCRIPTION
Junction to Ambient
(Airflow of 1m/s)
Junction to Case (Top)
Junction to Pins
(Bottom)
(Junction to Ambient)
2. Preliminary package data.
Test conditions follow standard test methods
Test conditions follow standard test methods
and procedures for measuring thermal
and procedures for measuring thermal
impedance, per EIA/JESD51.
impedance, per EIA/JESD51.
CONDITIONS
CONDITIONS
18
4Mb: 256K x 18, 128K x 32/36
FLOW-THROUGH ZBT SRAM
Micron Technology, Inc., reserves the right to change products or specifications without notice.
SYMBOL
SYMBOL
θ
θ
θ
θ
θ
JA
JC
JA
JC
JB
TYP
TYP
2.8
46
40
17
9
UNITS NOTES
UNITS NOTES
©2003, Micron Technology, Inc.
°C/W
°C/W
°C/W
°C/W
°C/W
1, 2
1, 2
1, 2
1
1