MT55L128L32F1 Micron Semiconductor Products, Inc., MT55L128L32F1 Datasheet - Page 25

• Manufacturer Part Number: MT55L128L32F1
• Description: 4Mb ZBT SRAM, 3.3V Vdd, 3.3V or 2.5V I/O, Flow-Through,
• Manufacturer: Micron Semiconductor Products, Inc.

4Mb: 256K x 18, 128K x 32/36 Flow-Through ZBT SRAM
MT55L256L18F1_F.p65 – Rev. F, Pub. 1/03 EN
SOLDER BALL DIAMETER REFERS
TO POST REFLOW CONDITION. THE
PRE-REFLOW DIAMETER IS Ø 0.40
NOTE: 1. All dimensions in millimeters MAX or typical where noted.
DATA SHEET DESIGNATIONS
No Marking: This data sheet contains minimum and maximum limits specified over the complete power supply
E-mail: [e-mail], Internet: http://www.micronsemi.com, Customer Comment Line: 800-932-4992
ZBT and Zero Bus Turnaround are trademarks of Integrated Device Technology, Inc., and the architecture is supported by
15.00 ±0.10
165X Ø 0.45
BALL A11
and temperature range for production devices. Although considered final, these specifications are
subject to change, as further product development and data characterization sometimes occur.
Micron, the Micron logo, and M logo are trademarks and/or service marks of Micron Technology, Inc.
7.50 ±0.05
7.00 ±0.05
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
0.85 ±0.075
5.00 ±0.05
MIN
13.00 ±0.10
Micron Technology, Inc., and Motorola, Inc.
10.00
6.50 ±0.05
165-PIN FBGA
1.00
TYP
25
C
1.00
TYP
BALL A1
PIN A1 ID
4Mb: 256K x 18, 128K x 32/36
14.00
SEATING PLANE
0.12 C
FLOW-THROUGH ZBT SRAM
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.20 MAX
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE: PLASTIC LAMINATE
SOLDER BALL MATERIAL:
EUTECTIC 62% Sn, 36% Pb, 2% Ag
SOLDER BALL PAD: Ø .33mm
PIN A1 ID
©2003, Micron Technology, Inc.