STGIPN3H60 STMicroelectronics, STGIPN3H60 Datasheet - Page 6

• Manufacturer Part Number: STGIPN3H60
• Manufacturer: STMicroelectronics

Electrical ratings
2
2.1
6/20
Electrical ratings
Absolute maximum ratings
Table 3.
1. Applied between
2. Calculated according to the iterative formula:
3. Pulse width limited by max junction temperature
Table 4.
Table 5.
1. The maximum junction temperature rating of the power chips integrated within the NDIP module is 150°C
Symbol
Symbol
± I
V
± I
Symbol
V
V
V
(@T
limited to T
P
V
SD/OD
V
V
V
T
CP
OUT
CES
boot
TOT
CIN
C
CC
T
IN
ISO
j
(1)
C
(2)
C
(3)
≤ 100°C). To ensure safe operation of the NDIP module, the average junction temperature should be
Output voltage applied between
OUT
Low voltage power supply
Comparator input voltage
Bootstrap voltage applied between
V
Logic input voltage applied between HIN, LIN and
GND
Open drain voltage
Each IGBT collector emitter voltage (V
Each IGBT continuous collector current
at T
Each IGBT pulsed collector current
Each IGBT total dissipation at T
j(avg)
Inverter part
Control part
Total system
boot i
Isolation withstand voltage applied between each
pin and heatsink plate (AC voltage, t = 60 sec.)
Operating junction temperature
Module case operation temperature
C
U,
≤ 125°C (@T
= 25°C
HIN
- OUT
OUT
i
, LIN
V,
I
i
C
OUT
for i = U, V, W
(
i
T
and GND for i = U, V, W
C
C
)
W
≤ 100°C).
Parameter
Parameter
Doc ID 018957 Rev 1
=
- GND (V
Parameter
-------------------------------------------------------------------------------------------------------
R
thj c
–
×
CC
V
C
CE sat
= 15 V)
= 25°C
(
T
j max
(
IN
) max
(
(1)
)
= 0)
–
)
(
T
T
C
j max
(
)
,
V
I
boot
C
(
-0.3 to V
T
C
- 21 to V
-0.3 to +21
-0.3 to 620
)
-0.3 to 15
-0.3 to 15
)
Value
Value
-40 to 150
-40 to 125
TBD
TBD
600
Value
3
1000
CC
boot
+0.3
+ 0.3
STGIPN3H60
Unit
Unit
Unit
°C
°C
W
V
V
V
V
V
V
V
A
A
V