74ACT541PC Fairchild Semiconductor, 74ACT541PC Datasheet - Page 7

IC BUFF/DVR TRI-ST 8BIT 20DIP

74ACT541PC

Manufacturer Part Number
74ACT541PC
Description
IC BUFF/DVR TRI-ST 8BIT 20DIP
Manufacturer
Fairchild Semiconductor
Series
74ACTr
Datasheet

Specifications of 74ACT541PC

Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
1
Number Of Bits Per Element
8
Current - Output High, Low
24mA, 24mA
Voltage - Supply
4.5 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Through Hole
Package / Case
20-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
©1988 Fairchild Semiconductor Corporation
74AC541, 74ACT541 Rev. 1.5.0
Physical Dimensions
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
10.65
10.00
INDICATOR
(R0.10)
PIN ONE
(R0.10)
7.60
7.40
B
Figure 1. 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
2.65 MAX
1.27
0.40
(1.40)
20
1
SEATING PLANE
DETAIL A
0.75
0.25
SCALE: 2:1
0.35
0.51
0.25
13.00
12.60
11.43
X 45°
GAGE PLANE
0.25
M
C
B
A
1.27
0.30
0.10
11
10
NOTES: UNLESS OTHERWISE SPECIFIED
A
A) THIS PACKAGE CONFORMS TO JEDEC
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS DO NOT INCLUDE MOLD
D) CONFORMS TO ASME Y14.5M-1994
E) LANDPATTERN STANDARD: SOIC127P1030X265-20L
F) DRAWING FILENAME: MKT-M20BREV3
C
7
0.10 C
MS-013, VARIATION AC, ISSUE E
FLASH OR BURRS.
LAND PATTERN RECOMMENDATION
2.25
1.27
SEE DETAIL A
SEATING PLANE
0.65
www.fairchildsemi.com
0.33
0.20
9.50

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