PUMA2E4001-12E Mosaic Semiconductor, PUMA2E4001-12E Datasheet - Page 14

• Manufacturer Part Number: PUMA2E4001-12E
• Description: 128K x 32 EEPROM Module
• Manufacturer: Mosaic Semiconductor

ISSUE 4.2 : November 1998
Military Screening Procedure
MultiChip Screening Flow for high reliability product is in accordance with Mil-883 method 5004 .
SCREEN
Visual and Mechanical
Internal visual
Temperature cycle
Constant acceleration
Endurance
Write Cycle endurance and
Data Retention performance
Burn-In
Pre-Burn-in electrical
Burn-in
Final Electrical Tests
Static (DC)
Functional
Switching (AC)
Percent Defective allowable (PDA)
Hermeticity
Fine
Gross
Quality Conformance
External Visual
MB MULTICHIP MODULE SCREENING FLOW
TEST METHOD
2010 Condition B or manufacturers equivalent
1010 Condition C (10 Cycles,-65
2001 Condition B (Y1 & Y2) (10,000g)
As per Internal Specification.
Per applicable device specifications at T
T
Per applicable Device Specification
a) @ T
b) @ temperature and power supply extremes
a) @ T
b) @ temperature and power supply extremes
a) @ T
b) @ temperature and power supply extremes
Calculated at post-burn-in at T
1014
Condition A
Condition C
2009 Per vendor or customer specification
Per Applicable Device Specification
A
=+125
14
A
A
A
=+25
=+25
=+25
o
C,160hrs min
o
o
o
C and power supply extremes
C and power supply extremes
C and power supply extremes
A
=+25
o
C to +150
o
C
A
=+25
o
C)
PUMA 2/67/77E4001/A - 12/15/20
o
C
Sample
LEVEL
100%
100%
100%
100%
100%
100%
100%
100%
100%
100%
100%
100%
100%
100%
10%