GP250MHB06S Dynex Semiconductor, GP250MHB06S Datasheet - Page 5

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GP250MHB06S

Manufacturer Part Number
GP250MHB06S
Description
Half Bridge IGBT Module
Manufacturer
Dynex Semiconductor
Datasheet
TYPICAL CHARACTERISTICS
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
www.dynexsemi.com
30.0
27.5
25.0
22.5
20.0
17.5
15.0
12.5
10.0
400
350
500
450
300
250
150
100
7.5
5.0
2.5
200
50
0
Fig.5 Typical turn-on energy vs collector current
0
0
0
T
V
V
Common emitter
T
j
GE
CE
case
= 25˚C
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
Fig.3 Typical output characteristics
= 300V
= 15V
= 25˚C
50
Collector-emitter voltage, V
Collector current, I
100
150
V
ge
= 20/15V
C
200
- (A)
ce
- (V)
A: R
B: R
C: R
250
V
V
g
g
ge
ge
g
A
B
C
= 15
= 10
= 5
= 12V
= 10V
300
5
30.0
27.5
25.0
22.5
20.0
17.5
15.0
12.5
10.0
7.5
5.0
2.5
400
350
500
450
300
250
150
100
200
0
Fig.6 Typical turn-on energy vs collector current
50
0
0
0
T
V
V
j
GE
CE
Common emitter
T
= 125˚C
case
Fig.4 Typical output characteristics
= 300V
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
= 15V
50
= 125˚C
Collector-emitter voltage, V
Collector current, I
100
150
GP250MHB06S
C
V
200
- (A)
ge
= 20/15V
ce
A: R
B: R
C: R
- (V)
250
g
g
V
V
g
A
B
C
= 15
= 10
= 5
ge
ge
= 12V
= 10V
300
5/10
5

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