HEF4516BP,652 NXP Semiconductors, HEF4516BP,652 Datasheet
HEF4516BP,652
Specifications of HEF4516BP,652
HEF4516BPN
HEF4516BPN
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HEF4516BP,652 Summary of contents
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HEF4516B Binary up/down counter Rev. 06 — 11 December 2009 1. General description The HEF4516B is an edge-triggered synchronous 4-bit binary up/down counter with a clock input (CP), an up/down count control input (UP/DN), an active LOW count enable input ...
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... NXP Semiconductors 5. Functional diagram Fig 1. Functional diagram HEF4516B_6 Product data sheet PARALLEL LOAD CIRCUITRY UP/DOWN UP/DN COUNTER Rev. 06 — 11 December 2009 HEF4516B Binary up/down counter 001aae667 © NXP B.V. 2009. All rights reserved ...
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... NXP Semiconductors UP/DN CE Fig 2. Logic diagram HEF4516B_6 Product data sheet FF1 FF2 Rev. 06 — 11 December 2009 HEF4516B Binary up/down counter FF3 FF4 001aaj798 © NXP B.V. 2009. All rights reserved ...
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... NXP Semiconductors 6. Pinning information 6.1 Pinning Fig 3. Pin configuration 6.2 Pin description Table 2. Pin description Symbol Pin 12, 13 11, 14 UP/ HEF4516B_6 Product data sheet HEF4516B UP/ 001aae689 Description parallel load input (active HIGH) parallel input count enable input (active LOW) parallel output ground supply voltage ...
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... NXP Semiconductors 7. Functional description [1] Table 3. Function table HIGH voltage level LOW voltage level don’t care; ↑ = positive-going transition. [ UP/ count Fig 4. Timing diagram HEF4516B_6 Product data sheet UP/ Rev. 06 — 11 December 2009 HEF4516B Binary up/down counter CP MODE X parallel load X no change ↑ ...
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... NXP Semiconductors Logic equation for terminal count: • ⁄ Fig 5. State diagram 8. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V supply voltage DD I input clamping current IK V input voltage I I output clamping current ...
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... NXP Semiconductors Table 5. Recommended operating conditions Symbol Parameter Δt/ΔV input transition rise and fall rate 10. Static characteristics Table 6. Static characteristics unless otherwise specified Symbol Parameter V HIGH-level input voltage IH V LOW-level input voltage IL HIGH-level output voltage | LOW-level output voltage OL I HIGH-level output current V ...
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... NXP Semiconductors 11. Dynamic characteristics Table 7. Dynamic characteristics ° for test circuit see SS amb Symbol Parameter Conditions t HIGH to LOW PHL propagation delay Qn LOW to HIGH PLH propagation delay HEF4516B_6 Product data sheet Figure 8; unless otherwise specified. V Extrapolation formula DD [ 118 ns + (0.55 ns/pF (0.23 ns/pF ...
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... NXP Semiconductors Table 7. Dynamic characteristics ° for test circuit see SS amb Symbol Parameter Conditions t transition time t f maximum frequency see max t pulse width CP input LOW; W minimum width; see PL input HIGH; minimum width; see MR input HIGH; minimum width; see t recovery time MR input; ...
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... NXP Semiconductors Table 8. Dynamic power dissipation P P can be calculated from the formulas shown Symbol Parameter dynamic power dissipation 12. Waveforms input input UP/DN input V SS Measurement points are given in Fig 6. Waveforms showing minimum pulse width for CP, set-up and hold times for and UP/ ...
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... NXP Semiconductors negative positive a. Input waveforms b. Test circuit Test data is given in Table 9. Definitions for test circuit: DUT = Device Under Test C = Load capacitance including jig and probe capacitance Termination resistance should be equal to output impedance Z T Fig 8. Test circuit for measuring switching times Table 9 ...
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... NXP Semiconductors 13. Package outline DIP16: plastic dual in-line package; 16 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT b max. min. max. 1.73 mm 4.2 0.51 3.2 1.30 0.068 inches 0.17 0.02 0.13 0.051 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. ...
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... NXP Semiconductors SO16: plastic small outline package; 16 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors 14. Revision history Table 10. Revision history Document ID Release date HEF4516B_6 20091211 • Modifications: Section 9 “Recommended operating conditions” HEF4516B_5 20090812 HEF4516B_4 20090312 HEF4516B_CNV_3 19950101 HEF4516B_CNV_2 19950101 HEF4516B_6 Product data sheet Data sheet status Change notice Product data sheet - Δt/ΔV values updated. ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Functional description . . . . . . . . . . . . . . . . . . . 5 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 8 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 14 Revision history ...