TDA2824 ST Microelectronics, TDA2824 Datasheet - Page 8
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TDA2824
Manufacturer Part Number
TDA2824
Description
DUAL POWER AMPLIFIER
Manufacturer
ST Microelectronics
Datasheet
1.TDA2824.pdf
(10 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TDA2824
Manufacturer:
ST
Quantity:
20 000
TDA2824
8/10
MOUNTING INSTRUCTION
The R
dering the GND pins to a suitable copperarea of the
printed circuit board (Figure 13) or to an external
heatsink (Figure 14).
The diagram of Figure 15 shows the maximum dis-
sipable power P
the side” ” oftwo equalsquare copper areas having
a thickness of 35
Figure 13 : Example of P.C. Board Copper Area
Figure 15 : Maximum Dissipable Power and
th j-amb
which is used as Heatsink.
Junction to Ambient Thermal
Resistance vs. Side ” ”.
of the TDA2824 can be reduced by sol-
tot
and the R
(1.4 mils).
th j-amb
as a function of
During soldering the pins temperature must not ex-
ceed 260 C and the soldering time must not be
longer than 12 seconds.
The external heatsink or printed circuit copper area
must be connected to electrical ground.
Figure 14 : External Heatsink Mounting Example.
Figure 16 : Maximum Allowable Power Dissipa-
tion vs. Ambient Temperature.