SHF-0189Z Sirenza Microdevices, SHF-0189Z Datasheet - Page 4

• Manufacturer Part Number: SHF-0189Z
• Description: GaAs HFET
• Manufacturer: Sirenza Microdevices

303 S. Technology Court, Broomfield, CO 80021
Mounting and Thermal Considerations
It is very important that adequate heat sinking be provided to
minimize the device junction temperature. The following items
should be implemented to maximize MTTF and RF
performance.
1. Multiple solder-filled vias are required directly below the
ground tab (pin 4). [CRITICAL]
2. Incorporate a large ground pad area with multiple plated-
through vias around pin 4 of the device. [CRITICAL]
3. Use two point board seating to lower the thermal
resistance between the PCB and mounting plate. Place
machine screws as close to the ground tab (pin 4) as
possible. [RECOMMENDED]
4. Use 2 ounce copper to improve the PCB’s heat spreading
capability. [RECOMMENDED]
Recommended Mounting Configuration for
Pin #
Optimum RF and Thermal Performance
2
3
4
1
(0.020" DIA)
Plated Thru
Machine
Screws
Holes
Function
Source
Source
Drain
Gate
Pin Description
RF Input
Connection to ground. Use via holes to reduce lead
inductance. Place vias as close to ground leads as possible.
RF Output
Same as Pin 2
Description
Ground Plane
SHF-0x89
Phone: (800) SMI-MMIC
4
SHF-0189 0.5 Watt HFET
Part Number
SHF-0189Z
The part will be symbolized with the “H1”
designator and a dot signifying pin 1 on the top
surface of the package.
SHF-0189
Part Number Ordering Information
1
Package Dimensions
.177 .068
Caution: ESD sensitive
Appropriate precautions in handling, packaging and
testing devices must be observed.
DIMENSIONS ARE IN INCHES
Part Symbolization
4
2
.059
Reel Size
3
7"
7"
.096
.161
1
.016
Devices/Reel
.041
.019
.015
1000
1000
.118
4
2
3
http://www.sirenza.com
EDS-101240 Rev E