MCM69F819 Motorola, MCM69F819 Datasheet - Page 7

• Manufacturer Part Number: MCM69F819
• Description: 256K x 18 Bit Flow-Through BurstRAM Synchronous Fast Static RAM
• Manufacturer: Motorola

NOTES:
NOTES:
NOTES:
MOTOROLA FAST SRAM
ABSOLUTE MAXIMUM RATINGS
PACKAGE THERMAL CHARACTERISTICS — PBGA
PACKAGE THERMAL CHARACTERISTICS — TQFP
Power Supply Voltage
I/O Supply Voltage
Input Voltage Relative to V SS for
Any Pin Except V DD
Input Voltage (Three–State I/O)
Output Current (per I/O)
Package Power Dissipation
Ambient Temperature
Die Temperature
Temperature Under Bias
Storage Temperature
Junction to Ambient (@ 200 lfm)
Junction to Board (Bottom)
Junction to Case (Top)
Junction to Ambient (@ 200 lfm)
Junction to Board (Bottom)
Junction to Case (Top)
1. Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are
2. This is a steady–state DC parameter that is in effect after the power supply has
3. Power dissipation capability is dependent upon package characteristics and use
1. Junction temperature is a function of on–chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
2. Per SEMI G38–87.
3. Indicates the average thermal resistance between the die and the printed circuit board.
4. Indicates the average thermal resistance between the die and the case top surface via the cold plate method (MIL SPEC–883 Method 1012.1).
1. Junction temperature is a function of on–chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
2. Per SEMI G38–87.
3. Indicates the average thermal resistance between the die and the printed circuit board.
4. Indicates the average thermal resistance between the die and the case top surface via the cold plate method (MIL SPEC–883 Method 1012.1).
exceeded. Functional operation should be restricted to RECOMMENDED OPER-
ATING CONDITIONS. Exposure to higher than recommended voltages for extended
periods of time could affect device reliability.
achieved its nominal operating level. Power sequencing is not necessary.
environment. See Package Thermal Characteristics.
temperature, air flow, board population, and board thermal resistance.
temperature, air flow, board population, and board thermal resistance.
Rating
V in , V out
Symbol
(See Note 1)
V DDQ
T bias
V DD
T stg
V IT
I out
P D
T A
T J
Rating
Rating
V SS – 0.5 to + 4.6
V SS – 0.5 to V DD
V SS – 0.5 to
V SS – 0.5 to
V DDQ + 0.5
– 55 to 125
V DD + 0.5
– 10 to 85
0 to 70
Value
110
1.6
20
Single Layer Board
Single Layer Board
Unit
mA
Four Layer Board
Four Layer Board
W
V
V
V
V
C
C
C
C
Notes
2
2
2
3
3
inputs against damage due to high static volt-
ages or electric fields; however, it is advised
that normal precautions be taken to avoid
application of any voltage higher than maxi-
mum rated voltages to this high–impedance
circuit.
Symbol
Symbol
R JA
R JB
R JC
R JA
R JB
R JC
This device contains circuitry to protect the
Max
Max
38
22
14
40
25
17
5
9
Unit
Unit
C/W
C/W
C/W
C/W
C/W
C/W
MCM69F819
Notes
Notes
1, 2
1, 2
3
4
3
4
7