ESDA14V2-1BF3 ST Microelectronics, ESDA14V2-1BF3 Datasheet - Page 6

• Manufacturer Part Number: ESDA14V2-1BF3
• Description: TVS Clamping Array
• Manufacturer: ST Microelectronics

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PCB recommendations
4
4.1
Note:
6/9
PCB recommendations
Design
For optimum electrical performance and highly reliable solder joints, STMicroelectronics
recommends the PCB design recommendations listed in
Table 3.
A gold layer finishing on the PCB pad that is too thick (0.2 µm maximum) is not
recommended (low joint reliability).
To optimize the natural self centering effect of CSP on the PCB, PCB pad positioning and
size have to be properly designed (see
Micro vias
An alternative to routing on the top surface is to route out on buried layers. To achieve this,
the pads are connected to the lower layers using micro vias. Only SSBU via technology is
approved.
Figure 14. Solder mask opening
For NSMD PCB
non solder mask defined
For SMD PCB
solder mask defined
PCB Pad Finishing
255 µm
PCB design recommendations for solder bar pitch 400 µm
180 µm
Non solder mask defined
Oblong pad: 370 x 180 µm
– Micro via SSBU allowed
– Micro via SBU to be avoided
– Micro via SBU filled (under qualification)
Track:
– Only one track per pad
– Maximum track width = 100 µm
Track layout must be symmetrical to the die axis (to homogenize stress
and welding attraction during reflow assembly)
Oblong pad:
– Micro via SSBU allowed
– Micro via SBU to be avoided
– Micro via SBU filled (under qualification)
Cu – Ni (2-6 µm) - Au (0.2 µm max)
Doc ID 15894 Rev 1
450 µm
370 µm
Figure
100 µm
14)
180 µm
Table
Solder mask defined
3.
370 µm
ESDA14V2-1BF3