74HCT7273D,118 NXP Semiconductors, 74HCT7273D,118 Datasheet - Page 15

• Manufacturer Part Number: 74HCT7273D,118
• Description: IC OCT D FF POS-EDGE TRIG 20SOIC
• Manufacturer: NXP Semiconductors
• Series: 74HCTr
• Type: D-Type Busr

Specifications of 74HCT7273D,118

• Function: Master Reset
• Output Type: Non-Inverted
• Number Of Elements: 1
• Number Of Bits Per Element: 8
• Frequency - Clock: 56MHz
• Delay Time - Propagation: 16ns
• Trigger Type: Positive Edge
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (7.5mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Output High, Low: -
• Other names: 74HCT7273D-T; 74HCT7273D-T; 935024080118

Philips Semiconductors
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
Introduction to soldering through-hole mount packages
This text gives a brief insight to wave, dip and manual soldering. A more in-depth account of soldering ICs can be found
in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board.
Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the
joints for more than 5 seconds.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
be necessary immediately after soldering to keep the temperature within the permissible limit.
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm
above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If
the bit temperature is between 300 and 400 C, contact may be up to 5 seconds.
1999 Oct 01
BGA, SQFP
HLQFP, HSQFP, HSOP, SMS
PLCC
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
Octal D-type flip-flop with reset; positive
edge-trigger; open drain outputs
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods” .
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
The package footprint must incorporate solder thieves downstream and at the side corners.
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
(3)
, SO, SOJ
PACKAGE
not suitable
not suitable
suitable
not recommended
not recommended
stg(max)
). If the printed-circuit board has been pre-heated, forced cooling may
(2)
WAVE
15
(3)(4)
(5)
SOLDERING METHOD
suitable
suitable
suitable
suitable
suitable
REFLOW
Product specification
74HCT7273
(1)