SSTUG32868 NXP Semiconductors, SSTUG32868 Datasheet - Page 27

• Manufacturer Part Number: SSTUG32868
• Description: Sstug32868 1.8 V 28-bit 1 2 Configurable Registered Buffer With Parity For Ddr2-1g Rdimm Applications
• Manufacturer: NXP Semiconductors

NXP Semiconductors
14. Abbreviations
15. Revision history
Table 15.
SSTUG32868_1
Product data sheet
Document ID
SSTUG32868_1
Revision history
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
Table 14.
Acronym
CMOS
DDR2
DIMM
DRAM
LVCMOS
PRR
RDIMM
SSTL
Fig 24. Temperature profiles for large and small components
Release date
20070423
MSL: Moisture Sensitivity Level
temperature
Abbreviations
Description
Complementary Metal Oxide Semiconductor
Double Data Rate 2
Dual In-line Memory Module
Dynamic Random Access Memory
Low Voltage Complementary Metal Oxide Semiconductor
Pulse Repetition Rate
Registered Dual In-line Memory Module
Stub Series Terminated Logic
Data sheet status
Product data sheet
Rev. 01 — 23 April 2007
= minimum soldering temperature
1.8 V DDR2-1G configurable registered buffer with parity
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
Change notice
-
SSTUG32868
temperature
Supersedes
-
peak
© NXP B.V. 2007. All rights reserved.
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