SSTUH32864EC/G NXP Semiconductors, SSTUH32864EC/G Datasheet
SSTUH32864EC/G
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SSTUH32864EC/G Summary of contents
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SSTUH32864 1.8 V high output drive configurable registered buffer for DDR2 RDIMM applications Rev. 01 — 22 April 2005 1. General description The SSTUH32864 is a 25-bit 14-bit configurable registered buffer designed for ...
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... Ordering information Table 1: Ordering information +70 C. amb Type number Solder process SSTUH32864EC/G Pb-free (SnAgCu solder ball compound) SSTUH32864EC SnPb solder ball compound 9397 750 14137 Product data sheet 1.8 V high output drive DDR registered buffer 5.5 mm, 0.8 mm ball pitch LFBGA package ...
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Philips Semiconductors 4. Functional diagram (1) Disabled configuration. Fig 1. Functional diagram of SSTUH32864 mode (positive logic) 9397 750 14137 Product data sheet 1.8 V high output drive DDR registered buffer RESET CK ...
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... Philips Semiconductors 5. Pinning information 5.1 Pinning Fig 2. Pin configuration for LFBGA96 Fig 3. Ball mapping register ( 0); top view 9397 750 14137 Product data sheet 1.8 V high output drive DDR registered buffer SSTUH32864EC/G ball A1 SSTUH32864EC index area 002aab116 Transparent top view DCKE n ...
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Philips Semiconductors Fig 4. Ball mapping register A ( 1); top view Fig 5. Ball mapping register B ( 1); top view 9397 750 14137 Product ...
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Philips Semiconductors 5.2 Pin description Table 2: Pin description Symbol Pin GND B3, B4, D3, D4, F3, F4, H3, H4, K3, K4, M3, M4, P3 A4, C3, C4, E3, DD E4, G3, G4, J3, J4, L3, L4, N3, ...
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Philips Semiconductors 6. Functional description 6.1 Function table Table LOW voltage level HIGH voltage level don’t care; = HIGH-to-LOW transition RESET ...
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Philips Semiconductors 7. Limiting values Table 4: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V supply voltage DD V receiver input voltage I V driver output voltage O I input clamp current IK ...
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Philips Semiconductors 8. Recommended operating conditions Table 5: Operating conditions Symbol Parameter V supply voltage DD V reference voltage ref V termination voltage TT V input voltage HIGH-level input voltage data inputs (Dn), IH(AC LOW-level ...
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Philips Semiconductors 9. Characteristics Table 6: Characteristics Recommended operating conditions; T unless otherwise specified Symbol Parameter V HIGH-level output voltage OH V LOW-level output voltage OL I input current I I static standby current DD static operating current I dynamic ...
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Philips Semiconductors Table 7: Timing requirements Recommended operating conditions; T See Figure 6 through Figure 11. Symbol Parameter f clock frequency clock t pulse duration, CK, CK HIGH or W LOW t differential inputs active time ACT t differential inputs ...
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Philips Semiconductors 10. Test information 10.1 Test circuit All input pulses are supplied by generators having the following characteristics: PRR 10 MHz; Z The outputs are measured one at a time with one transition per measurement. CK inputs (1) C ...
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Philips Semiconductors Fig 9. Voltage waveforms; setup and hold times Fig 10. Voltage waveforms; propagation delay times (clock to output) Fig 11. Voltage waveforms; propagation delay times (reset to output) 9397 750 14137 Product data sheet ...
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Philips Semiconductors 10.2 Output slew rate measurement All input pulses are supplied by generators having the following characteristics: PRR 10 MHz; Z (1) C Fig 12. Load circuit, HIGH-to-LOW slew measurement Fig 13. Voltage waveforms, ...
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Philips Semiconductors 11. Package outline LFBGA96: plastic low profile fine-pitch ball grid array package; 96 balls; body 13.5 x 5.5 x 1.05 mm ball A1 index area ...
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Philips Semiconductors 12. Soldering 12.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages ...
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Philips Semiconductors – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, ...
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Philips Semiconductors [4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, ...
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Philips Semiconductors 15. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualification III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...
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Philips Semiconductors 19. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...