SSTUB32865 NXP Semiconductors, SSTUB32865 Datasheet - Page 26

• Manufacturer Part Number: SSTUB32865
• Description: Sstub32865 1.8 V 28-bit 1 2 Registered Buffer With Parity For Ddr2-800 Rdimm Applications
• Manufacturer: NXP Semiconductors

NXP Semiconductors
14. Abbreviations
15. Revision history
Table 17.
SSTUB32865_3
Product data sheet
Document ID
SSTUB32865_3
Modifications:
SSTUB32865_2
SSTUB32865_1
Revision history
Release date
20070327
20060922
20060807
•
•
•
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
Table 16.
Acronym
CMOS
DDR2
DIMM
DRAM
LVCMOS
RDIMM
SSTL
The format of this data sheet has been redesigned to comply with the new identity guidelines of
NXP Semiconductors.
Legal texts have been adapted to the new company name where appropriate.
Table 10
Fig 23. Temperature profiles for large and small components
MSL: Moisture Sensitivity Level
temperature
“Characteristics”, I
Abbreviations
Data sheet status
Product data sheet
Product data sheet
Product data sheet
Description
Complementary Metal Oxide Semiconductor
Double Data Rate 2
Dual In-line Memory Module
Dynamic Random Access Memory
Low Voltage Complementary Metal Oxide Semiconductor
Registered Dual In-line Memory Module
Stub Series Terminated Logic
Rev. 03 — 27 March 2007
= minimum soldering temperature
DD
(max) for static standby current changed from “100 A” to “2 mA”
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
1.8 V DDR2-800 registered buffer with parity
Change notice
-
-
-
SSTUB32865
temperature
Supersedes
SSTUB32865_2
SSTUB32865_1
-
peak
© NXP B.V. 2007. All rights reserved.
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