adc12010civyx National Semiconductor Corporation, adc12010civyx Datasheet - Page 4

• Manufacturer Part Number: adc12010civyx
• Description: 12-bit, 10 Msps, 160 Mw A/d Converter With Internal Sample-and-hold
• Manufacturer: National Semiconductor Corporation

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ANALOG POWER
DIGITAL POWER
Pin Descriptions and Equivalent Circuits
Pin No.
5, 6, 29
4, 7, 28
14–19,
22–27
9, 12
13
21
20
DR GND
D0–D11
Symbol
AGND
DGND
V
V
V
DR
A
D
Equivalent Circuit
4
Digital data output pins that make up the 12-bit conversion
results. D0 is the LSB, while D11 is the MSB of the offset
binary output word. Output levels are TTL/CMOS compatible.
Positive analog supply pins. These pins should be connected
to a quiet +5V voltage source and be bypassed to AGND with
0.1 µF monolithic capacitors located within 1 cm of these
power pins, and with a 10 µF capacitor.
The ground return for the analog supply.
Positive digital supply pin. This pin should be connected to
the same quiet +5V source as is V
with a 0.1 µF monolithic capacitor in parallel with a 10 µF
capacitor, both located within 1 cm of the power pin.
The ground return for the digital supply.
Positive digital supply pin for the ADC12010’s output drivers.
This pin should be connected to a voltage source of +2.35V
to +5V and be bypassed to DR GND with a 0.1 µF monolithic
capacitor. If the supply for this pin is different from the supply
used for V
tantalum capacitor. V
V
supply pin.
The ground return for the digital supply for the ADC12010’s
output drivers. This pin should be connected to the system
digital ground, but not be connected in close proximity to the
ADC12010’s DGND or AGND pins. See Section 5 (Layout
and Grounding) for more details.
D
. All bypass capacitors should be located within 1 cm of the
(Continued)
A
and V
D
, it should also be bypassed with a 10 µF
DR
should never exceed the voltage on
Description
A
and bypassed to DGND