tda8594sd-n1 NXP Semiconductors, tda8594sd-n1 Datasheet - Page 45
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tda8594sd-n1
Manufacturer Part Number
tda8594sd-n1
Description
Tda8594 I?c-bus Controlled 4 X 50 W Power Amplifier
Manufacturer
NXP Semiconductors
Datasheet
1.TDA8594SD-N1.pdf
(48 pages)
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NXP Semiconductors
16. Mounting
17. Abbreviations
TDA8594_2
Product data sheet
Table 18.
Acronym
ACK
BCDMOS
BTL
CMOS
DMOS
DSP
EMC
ESR
LSB
MSB
NMOS
PMOS
PCB
POR
SOAR
SOI
Fig 39. SOT878-1 reflow soldering footprint
Dimensions in mm.
Reflow soldering is the recommended soldering method.
Dimension ‘1’ relates to dimension ‘e
Figure
Abbreviations
38.
hole diameter min. 0.92
27
26
Description
ACKnowledge not
Bipolar CMOS/DMOS
Bridge Tied Load
Complementary Metal-Oxide Semiconductor
Double-diffused Metal-Oxide Semiconductor
Digital Signal Processor
ElectroMagnetic Compatibility
Equivalent Series Resistance
Least Significant Bit
Most Significant Bit
Negative-channel Metal-Oxide Semiconductor
Positive-channel Metal-Oxide Semiconductor
Printed-Circuit Board
Power-On Reset
Safe Operating ARea
Silicon On Insulator
2
Rev. 02 — 11 December 2007
1
’ in
Figure
0.08
I
2
C-bus controlled 4
M
38; dimension ‘2’ relates to dimension ‘e
Dimensions in mm
1
2
sot878-1_fr
50 W power amplifier
1
TDA8594
2.54
© NXP B.V. 2007. All rights reserved.
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’ in
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