tda8932t-n1 NXP Semiconductors, tda8932t-n1 Datasheet - Page 27

• Manufacturer Part Number: tda8932t-n1
• Description: Tda8932 Class-d Audio Amplifier
• Manufacturer: NXP Semiconductors

NXP Semiconductors
TDA8932_2
Preliminary data sheet
14.6 Device synchronization
14.7 Thermal behavior (printed-circuit board considerations)
Where:
Example:
Substituting R1 = R2 = 4.7 k , Z
results in a gain of G
If two or more TDA8932 devices are used in one application it is recommended that all
devices are synchronized running at the same switching frequency to avoid beat tones.
Synchronization can be realized by connecting all OSCIO pins together and configure one
of the TDA8932 devices as master, while the other TDA8932 devices are configured as
slaves (see
A device is configured as master by connecting a resistor between pins OSCREF and
V
oscillator output for synchronization. The OSCREF pins of the slave devices should be
shorted to V
The heatsink in the application with the TDA8932 is made with the copper on the
Printed-Circuit Board (PCB). The TDA8932 uses the four corner leads (pins 1, 16, 17 and
32) for heat transfer from the die to the PCB. The thermal foldback will limit the maximum
junction temperature to 140 C.
R
Fig 10. Master slave concept in two chip application
SSD(HW)
R
R3 = parallel resistor [ ]
Z
EQ
i
EQ
= internal input impedance
=
= equivalent resistance [ ]
----------------- -
R3
R3
setting the carrier frequency. Pin OSCIO of the master is then configured as an
+
Figure
SSD(HW)
Z
Z
i
i
10).
configuring pin OSCIO as an input.
v(tot)
Rev. 02 — 12 December 2006
100 nF
C osc
= 26.3 dB.
master
OSCREF
TDA8932
i
R osc
39 k
V
= 100 k and R3 = 22 k in
SSD
IC1
OSCIO
slave
OSCIO
TDA8932
IC2
OSCREF
001aad761
Equation 8
V SSD
Class-D audio amplifier
TDA8932
© NXP B.V. 2006. All rights reserved.
and
Equation 9
27 of 45
(9)