xcv100e Xilinx Corp., xcv100e Datasheet - Page 4

no-image

xcv100e

Manufacturer Part Number
xcv100e
Description
Virtex?-e 1.8 V Field Programmable Gate Arrays
Manufacturer
Xilinx Corp.
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
XCV100E
Quantity:
5 510
Part Number:
XCV100E
Manufacturer:
TOSHIBA
Quantity:
5 510
Part Number:
XCV100E
Manufacturer:
XILINX
0
Part Number:
xcv100e FG256AGT 8C
Manufacturer:
XILINX
0
Part Number:
xcv100e-2FG256
Manufacturer:
XILINX
Quantity:
853
Part Number:
xcv100e-2PQ240
Manufacturer:
XILINX
0
Part Number:
xcv100e-4FG256C
Manufacturer:
XILINX
Quantity:
12 388
Part Number:
xcv100e-5BG352C
Manufacturer:
XILINX
0
Part Number:
xcv100e-5FG256I
Manufacturer:
XILINX
0
Part Number:
xcv100e-6BG352C
Manufacturer:
XILINX
Quantity:
80
Part Number:
xcv100e-6BG352I
Manufacturer:
XILINX
Quantity:
80
Virtex™-E 1.8 V Field Programmable Gate Arrays
Virtex-E Ordering Information
Revision History
The following table shows the revision history for this document.
Module 1 of 4
4
12/7/99
1/10/00
1/28/00
2/29/00
5/23/00
7/10/00
9/20/00
8/1/00
Date
Version
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
Example: XCV300E-6PQ240C
Device Type
Speed Grade
(-6, -7, -8)
Initial Xilinx release.
Re-released with spd.txt v. 1.18, FG860/900/1156 package information, and additional DLL,
Select RAM and SelectI/O information.
Added Delay Measurement Methodology table, updated SelectI/O section, Figures 30, 54,
& 55, text explaining Table 5, T
Measurement notes, notes for Tables 15, 16, and corrected F1156 pinout table footnote
references.
Updated pinout tables, V
Correction to table on p. 22.
Numerous minor edits.
Data sheet upgraded to Preliminary.
Preview -8 numbers added to Virtex-E Electrical Characteristics tables.
Reformatted entire document to follow new style guidelines.
Changed speed grade values in tables on pages 35-37.
Min values added to Virtex-E Electrical Characteristics tables.
XCV2600E and XCV3200E numbers added to Virtex-E Electrical Characteristics
tables (Module 3).
Corrected user I/O count for XCV100E device in Table 1 (Module 1).
Changed several pins to “No Connect in the XCV100E“ and removed duplicate V
pins in Table ~ (Module 4).
Changed pin J10 to “No connect in XCV600E” in Table 74 (Module 4).
Changed pin J30 to “VREF option only in the XCV600E” in Table 74 (Module 4).
Corrected pair 18 in Table 75 (Module 4) to be “AO in the XCV1000E, XCV1600E“.
Figure 1: Ordering Information
www.xilinx.com
1-800-255-7778
CC
page 20, and corrected Figure 20.
BYP
Temperature Range
C = Commercial (Tj = 0 C to +85 C)
Number of Pins
Package Type
BG = Ball Grid Array
FG = Fine Pitch Ball Grid Array
HQ = High Heat Dissipation
I = Industrial (Tj = -40 C to +100 C)
values, buffered Hex Line info, p. 8, I/O Timing
Revision
DS022_043_072000
Production Product Specification
DS022-1 (v2.3) July 17, 2002
CCINT
R

Related parts for xcv100e