mpc8343e Freescale Semiconductor, Inc, mpc8343e Datasheet - Page 50

• Manufacturer Part Number: mpc8343e
• Description: Mpc8343e Powerquicc
• Manufacturer: Freescale Semiconductor, Inc

Package and Pin Listings
18 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions. The MPC8343E is available in
a plastic ball grid array (PBGA). See
Section 18.2, “Mechanical Dimensions for the MPC8343E PBGA.”
18.1
The package parameters are as provided in the following list. The package type is 29 mm × 29 mm,
620 plastic ball grid array (PBGA).
50
Package outline
Interconnects
Pitch
Module height (maximum)
Module height (typical)
Module height (minimum)
Solder balls
Ball diameter (typical)
MPC8343E PowerQUICC™ II Pro Integrated Host Processor Hardware Specifications, Rev. 11
Package Parameters for the MPC8343E PBGA
Section 18.1, “Package Parameters for the MPC8343E PBGA,”
29 mm × 29 mm
1.00 mm
2.46 mm
2.23 mm
2.00 mm
62 Sn/36 Pb/2 Ag (ZQ package)
95.5 Sn/0.5 Cu/4Ag (VR package)
620
0.60 mm
Freescale Semiconductor
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