mpc755ed Freescale Semiconductor, Inc, mpc755ed Datasheet - Page 10

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mpc755ed

Manufacturer Part Number
mpc755ed
Description
Risc Microprocessor Hardware Specifications
Manufacturer
Freescale Semiconductor, Inc
Datasheet
Electrical and Thermal Characteristics
Table 6
10
At recommended operating conditions (see
At recommended operating conditions (see
Temperature range
Comparator settling time
Resolution
Accuracy
Notes:
1. The temperature is the junction temperature of the die. The thermal assist unit’s raw output does not indicate an absolute
2. The comparator settling time value must be converted into the number of CPU clocks that need to be written into the THRM3
3. Guaranteed by design and characterization.
Input high voltage (all inputs except SYSCLK)
Input low voltage (all inputs except SYSCLK)
SYSCLK input high voltage
SYSCLK input low voltage
Input leakage current,
V
High-Z (off-state) leakage current,
V
Output high voltage, I
Output low voltage, I
in
in
temperature, but must be interpreted by software to derive the absolute junction temperature. For information about the use
and calibration of the TAU, see Freescale Application Note AN1800/D, Programming the Thermal Assist Unit in the MPC750
Microprocessor.
SPR.
= L2OV
= L2OV
provides the DC electrical characteristics for the MPC755.
DD
DD
/OV
/OV
Characteristic
DD
DD
OL
OH
= 6 mA
= –6 mA
MPC755 RISC Microprocessor Hardware Specifications, Rev. 8
Characteristic
Table
Table
Table 5. Thermal Sensor Specifications
Table 6. DC Electrical Specifications
3)
3)
Voltage
Nominal
Bus
2.5
3.3
2.5
3.3
2.5
3.3
2.5
3.3
2.5
3.3
2.5
3.3
1
Symbol
KV
KV
KV
KV
V
V
V
V
V
V
I
V
V
I
TSI
OH
OH
OL
OL
in
IH
IH
IL
IL
IH
IH
IL
IL
–0.3
–0.3
–0.3
–0.3
Min
1.6
2.0
1.8
2.4
1.7
2.4
Min
–12
20
0
4
(L2)OV
(L2)OV
OV
OV
DD
DD
Max
0.45
0.6
0.8
0.4
0.4
0.4
Max
10
10
127
+12
DD
DD
+ 0.3
+ 0.3
Freescale Semiconductor
+ 0.3
+ 0.3
Unit
Unit
°C
°C
°C
µA
µA
µs
V
V
V
V
V
V
V
V
V
V
V
V
Notes
Notes
2, 3, 5
2, 3
2, 3
2, 3
2, 3
1
3
3
2

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