tle8262-2e Infineon Technologies Corporation, tle8262-2e Datasheet - Page 7
![no-image](/images/no-image-200.jpg)
tle8262-2e
Manufacturer Part Number
tle8262-2e
Description
Universal System Basis Chip Hermes
Manufacturer
Infineon Technologies Corporation
Datasheet
1.TLE8262-2E.pdf
(94 pages)
- Current page: 7 of 94
- Download datasheet (2Mb)
3
3.1
Figure 2
Data Sheet
V
V
V
V
cc3shunt
ccHSCAN
Bus1
cc3REF
GND
cc3
SDO
GND
V
CSN
CLK
n.c.
SDI
V
RO
cc1
INT
Vs
Vs
base
cc2
µC
Pin Configuration
Pin Assignments
Pin Configuration
10
11
12
13
14
15
16
17
18
1
2
3
4
5
6
7
8
9
DSO 36 - Exposed Pad
TLE8262-2E
Exposed
Pad
Die
7
Pinout_8262_2E.vsd
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
LH_PL/Test
Limp home
WK
LH_SI
n.c.
GND
n.c.
n.c.
n.c.
n.c.
RxD
TxD
RxD
TxD
GND
CANL
SPLIT
CANH
Rev. 1.0, 2009-05-26
Pin Configuration
TLE8262-2E
LIN
CAN
LIN
CAN
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