tle8262-2e Infineon Technologies Corporation, tle8262-2e Datasheet - Page 89
![no-image](/images/no-image-200.jpg)
tle8262-2e
Manufacturer Part Number
tle8262-2e
Description
Universal System Basis Chip Hermes
Manufacturer
Infineon Technologies Corporation
Datasheet
1.TLE8262-2E.pdf
(94 pages)
- Current page: 89 of 94
- Download datasheet (2Mb)
16.1
Figure 44
Figure 45
Board set-up is done according to
Data Sheet
600mm² cooling area
60
50
40
30
20
10
0,00001
0
ZthJA Curve
ZthJA Curve, Function of Cooling Area
Board Set-up
0,0001
Zth-JA(Ch4; 600)
Zth-JA(Ch4; 300)
Zth-JA(Ch4; 100)
Zth-JA(Ch4; footprint)
0,001
300mm² cooling area
JESD 51-3, single layer FR4 PCB 70 µm
0,01
0,1
tim e (s)
89
100mm² cooling area
1
10
.
100
Application Information
PCB set up.vsd
1000
minimum footprint
Rev. 1.0, 2009-05-26
Zthja curves.vsd
TLE8262-2E
10000
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