hsdl-3601 Avago Technologies, hsdl-3601 Datasheet
hsdl-3601
Available stocks
Related parts for hsdl-3601
hsdl-3601 Summary of contents
Page 1
... General Data Collection Devices - Patient & Pharmaceutical Data Collection Devices IR LANs FIR_SEL (3) Description The HSDL-3601 is a low-profile infrared transceiver module that provides interface between logic and IR signals for through-air, serial, half-duplex IR data link. The module is compliant to IrDA Data Physical Layer Specifications 1.1 and IEC825- Class 1 Eye Safe ...
Page 2
... The HSDL-3601 contains a high- speed and high-efficiency 870 nm LED, a silicon PIN diode, and an integrated circuit. The IC contains an LED driver and a receiver providing a single output (RXD) for all data rates supported. The HSDL-3601 can be completely shut down to achieve very low power consumption. In ...
Page 3
... High 0 Low [4] X Low 3 Description Symbol Vcc AGND FIR_SEL MD0 MD1 NC GND RXD TXD LEDA BOTTOM VIEW (HSDL-3601 #008/#018) Shutdown Outputs LED RXD On Not Valid [3] Off Low [3] Off Low Off High Not Valid Not Valid 2 1 ...
Page 4
... Watt, for 4.75 [5] CX1 0.47 F 20%, X7R Ceramic [6] CX2 6.8 F 20%, Tantalum Notes: 5. CX1 must be placed within 0 the HSDL-3601 to obtain optimum noise immunity environments with noisy power supplies, supply rejection performance can be enhanced by including CX2, as shown in “HSDL-3601 Functional Block Diagram” in page 3. 0.7 0.6 0.5 0.4 0.3 0.2 0 ...
Page 5
Absolute Maximum Ratings Parameter Symbol Storage Temperature T S Operating Temperature LED Current I (DC) LED Peak LED Current I (PK) LED LED Anode Voltage V LEDA Supply Voltage Vcc Transmitter Data I (DC) TXD Input Current ...
Page 6
Electrical & Optical Specifications Specifications hold over the Recommended Operating Conditions unless otherwise noted. Unspecified test conditions can be anywhere in their operating range. All typical values are and 5 V unless otherwise noted. Parameter Transceiver Supply ...
Page 7
... Pulse width specified is the pulse width of the second 500 kHz carrier pulse received in a data bit. The first 500 kHz carrier pulse may exceed width, which will not affect correct demodulation of the data stream. An ASK or DASK system using the HSDL-3601 has been shown to correctly receive all data bits for 9 W/cm or DASK should use the FIR channel enabled. ...
Page 8
TXD “Stuck ON” Protection TXD LED t pw (MAX.) LED Optical Waveform t pw LED ON 90% 50% 10% LED OFF RXD Output Waveform V OH 90% 50% 10 Receiver Wake Up Time ...
Page 9
... HSDL-3601#007 and HSDL3601#017 Package Outline with Dimension and Recommended PC Board Pad Layout HSDL-3601#007/#017 (Front Option) PIN FUNCTION PIN FUNCTION AGND 7 GND 3 FIR_SEL 8 RXD 4 MD0 9 TXD 5 MD1 10 LEDA 2.55 0.80 1.20 4.05 SIDE VIEW ALL DIMENSIONS IN MILLIMETERS (mm). DIMENSION TOLERANCE IS 0.20 mm UNLESS OTHERWISE SPECIFIED. ...
Page 10
... HSDL-3601#008 and HSDL3601#018 Package Outline with Dimension and Recommended PC Board Pad Layout HSDL-3601#008/#018 (Top Option) PIN FUNCTION PIN FUNCTION AGND 7 GND 3 FIR_SEL 8 RXD 4 MD0 9 TXD 5 MD1 10 LEDA LEGEND: MC – MOUNTING CENTER OC – OPTICAL CENTER 2.40 1.50 2.25 SIDE VIEW ALL DIMENSIONS IN MILLIMETERS (mm). ...
Page 11
... SHAPE AND DIMENSIONS OF REELS 4.00 ± 0.10 2.00 ± 0.10 + 0.10 1.50 0 POLARITY A 12.40 ± 0. 5.50 ± 0.10 0.40 ± 0.05 4.20 ± 0.10 DIRECTION OF PULLING Quantity = 400 pieces per reel (HSDL-3601#007) Quantity = 10 pieces per tape (HSDL-3601#017) (40 mm MIN.) PARTS EMPTY MOUNTED 2.00 ± 0.50 DIRECTION OF PULLING CONFIGURATION OF TAPE 1.75 ± 0.10 11.50 ± 0.10 24.00 ± 0.20 8.00 ± 0.10 TAPE DIMENSIONS 11 (400 mm MIN ...
Page 12
... SHAPE AND DIMENSIONS OF REELS 4.00 ± 0.10 2.00 ± 0.10 1.50 + 0.10 POLARITY V DD 12.80 ± 0.10 A 4.80 ± 0.10 0.40 ± 0.05 5.65 ± 0.10 5.10 ± 0.10 DIRECTION OF PULLING Quantity = 400 pieces per reel (HSDL-3601#008) Quantity = 10 pieces per tape (HSDL-3601#018) (40 mm MIN.) PARTS EMPTY MOUNTED 2.00 ± 0.50 DIRECTION OF PULLING CONFIGURATION OF TAPE 1.75 ± 0.10 11.50 ± 0.10 24.00 ± 0.20 178.00 ± 2.00 5.30 ± ...
Page 13
... Moisture Proof Packaging All HSDL-3601 options are shipped in moisture proof package. Once opened, moisture absorption begins. UNITS IN A SEALED MOISTURE-PROOF PACKAGE PACKAGE IS OPENED (UNSEALED) ENVIRONMENT LESS THAN 25°C, AND LESS THAN 60% RH? NO PACKAGE IS OPENED MORE THAN 3 DAYS? YES PERFORM RECOMMENDED BAKING CONDITIONS ...
Page 14
... The cool down rate, R5, from the liquidus point of the solder (77 F) should not exceed -3 C per second maximum. This limitation is necessary to allow the PC board and HSDL-3601 castellation I/O pins to change dimensions evenly, putting minimal stresses on the HSDL-3601 transceiver. ...
Page 15
Appendix A: Test Method A1. Background Light and Electromagnetic Field There are four ambient interference conditions in which the receiver is to operate correctly. The conditions are to be applied separately: 1. Electromagnetic field: 3 V/m maximum (please refer to ...
Page 16
... Appendix B : HSDL-3601#007/#017 SMT Assembly Application Note 1.0 Solder Pad, Mask and Metal Solder Stencil Aperture STENCIL APERTURE SOLDER MASK Figure 1.0. Stencil and PCBA. 1.1 Recommended Land Pattern for HSDL-3601#007/#017 Dim. mm Inches a 2.40 0.095 b 0.70 0.028 c (pitch) 1.10 0.043 d 2.35 0.093 e 2.80 0.110 f 3.13 0.123 g 4.31 0.170 METAL STENCIL ...
Page 17
... Note: Wet/Liquid Photo-Imaginable solder resist/mask is recommended LENS LAND h Y Figure 3.0. HSDL-3601#007/#017 PCBA – Adjacent Land Keep-out and Solder Mask LENS k SOLDER MASK l ...
Page 18
Recommended Metal Solder Stencil Aperture It is recommended that only 0.152 mm (0.006 inches) or 0.127 mm (0.005 inches) thick stencil be used for solder paste t, nominal stencil thickness mm 0.152 0.127 w, the width of aperture is ...
Page 19
Tolerance for X-axis Alignment of Castellation Misalignment of castellation to the land pad should not exceed 0 approximately half the width of the castellation during Photo 1.0. Castellation misaligned to land pads in x-axis before reflow. 3.2 ...
Page 20
... IR Hot-air convection reflow oven. Direction of board travel does not matter. mark (mid-length of land pad.) This will enable sufficient land 1 length (minimum of / land 2 length.) to form a good joint. See Fig 5.0. EDGE FIDUCIAL 4.0 Solder Volume Evaluation and Calculation Geometry of an HSDL-3601#007/#017 solder fillet. 0.8 1.2 0.4 20 0.425 0.20 0.70 0.7 ...
Page 21
... Appendix C: HSDL-3601#008/#018 SMT Assembly Application Note 1.0 Solder Pad, Mask and Metal Solder Stencil Aperture STENCIL APERTURE SOLDER MASK Figure 1.0. Stencil and PCBA. 1.1 Recommended Land Pattern for HSDL-3601#008/#018 Dim. mm Inches a 1.95 0.077 b 0.60 0.024 c (pitch) 1.10 0.043 d 1.60 0.063 e 5.70 0.224 f 3.80 0.150 g 2.40 0.094 h 0.80 0.032 METAL STENCIL ...
Page 22
... Note: Wet/Liquid Photo-Imaginable solder resist/mask is recommended LENS LAND h Y Figure 3.0. HSDL-3601#008/#018 PCBA – Adjacent Land Keep-out and Solder Mask LENS k SOLDER MASK l ...
Page 23
Recommended Metal Solder Stencil Aperture It is recommended that only 0.152 mm (0.006 inches) or 0.127 mm (0.005 inches) thick stencil be used for solder paste t, nominal stencil thickness mm 0.152 0.127 w, the width of aperture is ...
Page 24
Tolerance for X-axis Alignment of Castellation Misalignment of castellation to the land pad should not exceed 0 approximately half the width of the castellation during Solder Castellation Photo 1.0. Castellation mis-aligned to land pads in X-axis before ...
Page 25
Y-axis Misalignment of Castellation In the Y-direction, the unit does not self align after solder reflow recommended that the unit Tx LENS Rx LENS Y Figure 5.0. Section of a Castellation in Y-axis. 3.4 Example of Good ...
Page 26
... Solder Volume Evaluation and Calculation Geometry of an HSDL-3601#008/#018 solder fillet. 0.46 0.6 0.1 0 (0.8 x 0.6 x 0.1) + (0.5 x 0.6 x 0.46 (0.6 + 1.15)/2) = 0.1662 mm solder /0.6 = 0.277 mm paste solder 0.6 1. ...
Page 27
... Appendix D: General Application Guide for the HSDL-3601 ® Infrared IrDA Compliant 4 Mb/s Transceiver Description The HSDL-3601 wide voltage operating range infrared transceiver is a low-cost and small form factor that is designed to address the mobile computing market such as notebooks, printers and LAN access as well as small embedded ...
Page 28
... IRTX PC97/87338VJG 63 PC87308VUL 81 PC87108AVHG 39 Please refer to the National Semiconductor data sheets and application notes for updated information TXD (9) SP IRTX MD0 (4) IRRX1 MD1 (5) HSDL-3601 * * RXD (8) IRSL0 FIR_SEL (3) GND (7) * MODE GROUND FOR FULL POWER OPERATION AGND (2) 28 IRRX1 IRSL0 ...
Page 29
... Test Procedures 1. Two PC97338VJG evaluation boards were connected to the ISA Bus of two PCs (Pentium 200 MHz) running Microsoft’s DOS operating system. One system with an HSDL-3601 IR transceiver connected to the PC97338VJG evaluation Functional Block Diagram 14.314 MHz CLOCK ...
Page 30
... FOR FULL POWER Note that the buffer in the TXD line to IRRX and RXD line to IRTX is used only when interfacing the FDC37C669FR to HSDL-3601. This is not required with the other SMC Super and Ultra I/O Controllers. Please refer to the SMC datasheets and applications notes for updated information. ...
Page 31
Data subject to change. Copyright © 2000 Agilent Technologies Inc. Obsoletes 5968-7601E (9/99) 5980-0877E (7/00) ...