hsdl-3603 Avago Technologies, hsdl-3603 Datasheet

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hsdl-3603

Manufacturer Part Number
hsdl-3603
Description
Infrared Transceiver - Agilent Hewlett-packard
Manufacturer
Avago Technologies
Datasheet

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Part Number
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Quantity
Price
Part Number:
hsdl-3603-007
Manufacturer:
AVAGO
Quantity:
15 000
Description
The HSDL-3603 is a low profile
infrared transceiver module that
provides interface between logic
and IR signals for through-air,
serial, half-duplex IR data-link. The
module is fully compliant to IrDA
Date Physical Layer Specifications
v1.4 Fct Infrared (FIR) and IEC825-
Class I Eye Safe.
The HSDL-3603 can be shut down
completely to achieve very low
power consumption. In the
shutdown mode, the PIN diode will
be inactive and thus producing very
little photocurrent even under very
bright ambient light. Such features
are ideal for mobile devices that
require low power consumption.
Applications
• Digital imaging
• Data communication
• Digital imaging
• Telecommunication products
• Electronic wallet
• Small industrial and medical
• IR LANs
Agilent HSDL-3603
IrDA
4 Mbit/s Infrared Transceiver
Data Sheet
– Digital still cameras
– Photo-imaging printers
– Notebook computers
– Desktop PCs
– WinCE handheld products
– Personal Digital Assistants
– Printers
– Auto PCs
– Dongles
– Set-top box
– Digital cameras
– Photo-imaging printers
– Mobile phones
– Pagers
instrumentation
– General data collection
– Patient and pharmaceutical
devices
data collection devices
®
Data Compliant
Features
• Fully compliant to IrDA 1.4 Fast
• Typical link distance > 1.5 m
• Miniature package
• Guaranteed temperature
• Low power consumption
• Withstands >100 mV
• V
• Integrated EMI shield
• LED stuck-high protection
• Designed to accommodate light
• IEC 825-Class 1 eye safe
• Interface to various super I/O and
Infrared (FIR) from 9.6 kbit/s to
4 Mbit/s
– Height: 3.90 mm
– Width: 9.80 mm
– Depth: 4.65 mm
performance, -25 to 70 C
– Critical parameters are
– Low shutdown current
– Complete shutdown of TXD, RXD,
supply ripple typically
loss with cosmetic windows
controller devices
CC
guaranteed over temperature
and supply voltage
and PIN diode
(10 nA typical)
supply 2.7 to 5.25 volts
p-p
power

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hsdl-3603 Summary of contents

Page 1

... Description The HSDL-3603 is a low profile infrared transceiver module that provides interface between logic and IR signals for through-air, serial, half-duplex IR data-link. The module is fully compliant to IrDA Date Physical Layer Specifications v1.4 Fct Infrared (FIR) and IEC825- Class I Eye Safe. The HSDL-3603 can be shut down completely to achieve very low power consumption ...

Page 2

... CC RECEIVER SD/MODE (5) RXD (4) HSDL-3603 TRANSMITTER TXD (3) LED C ( LED A (1) Figure 1. HSDL-3603 functional block diagram. Ordering Information Part Number Packaging Type HSDL-3603-007 Tape and Reel Marking Information The unit is marked with 3603yyww on the shield. 3603 = Product name yy = year ww = work week ...

Page 3

... F 20%, X7R Ceramic CX2 6.8 F 20%, Tantalum Notes: 1. CX1 must be placed within 0 the HSDL-3603 to obtain optimum noise immunity environments with noisy power supplies, supply rejection performance can be enhanced by including CX2, as shown in Figure 1: ”HSDL-3603 Functional Block Diagram“ on Page 2. 3 Function This pin can be connected directly less than 3 V ...

Page 4

Bandwidth Selection Timing The transceiver is in default SIR/ MIR mode when powered on. User needs to apply the following programming sequence to both the SD and TXD inputs to enable the transceiver to operate at FIR mode. SD/MODE t ...

Page 5

Transceiver I/O Truth Table Inputs TXD Light Input to Receiver High Don’t Care Low High Low Low Don’t Care Don’t Care Notes: 1. In-band IrDA signals and data rates 4Mbit/s. 2. RXD logic low is a pulsed response. The condition ...

Page 6

Absolute Maximum Ratings For implementations where case to ambient thermal resistance is 50 C/W. Parameter Symbol Storage Temperature T Operating Temperature T LED Anode Voltage V Supply Voltage V Input Voltage: TXD, SD/Mode V Output Voltage: RXD V DC LED ...

Page 7

Electrical and Optical Specifications Specifications (Min. and Max. values) hold over the recommended operating conditions unless otherwise noted. Unspecified test conditions may be anywhere in their operating range. All typical values (Typ.) are with V otherwise noted. ...

Page 8

RADIANT INTENSITY (mW/Sr) vs. ILED T = 25° 3.0 V, ON-AXIS A CC 390 370 350 330 310 290 270 250 230 210 190 170 150 250 300 350 400 450 500 550 600 650 ILED (mA) Figure ...

Page 9

... HSDL-3603 Package Outline Dimensions 1.00 EMITTING CENTER 93° ± 1° 3.90 –0.10 0.1 +0.20 3.85 4.10 0.95 UNIT: mm TOLERANCE: ± 0.2 mm Figure 12. Package outline dimensions. 9 4.90 MOUNTING CENTER LIGHT RECEIVING 9.80 CENTER 0.37 0.83 1.70 0. 0.65 3.5 P1 LEDA 5 SD/MODE 2 LEDC 6 Vcc 3 TXD RXD 8 GND 4.65 0.25 ...

Page 10

... HSDL-3603 Tape and Reel Dimensions 5°(MAX.) POLARITY PIN 8: GND 9.50 ± 0.10 PIN 1: LED A 0.30 ± 0.10 4.50 ± 0.10 MATERIAL OF CARRIER TAPE: CONDUCTIVE POLYSTYRENE MATERIAL OF COVER TAPE: PVC METHOD OF COVER: HEAT ACTIVATED ADHESIVE LABEL Figure 13. Tape and reel dimensions. 10 4.00 ± 0.10 1.55 ± 0.05 +0.10 3.46 0 +0.10 3.30 0 2.46 ± 0.10 5°(MAX.) 4.65 ± ...

Page 11

... Moisture Proof Packaging All HSDL-3603 options are shipped in moisture proof package. Once opened, moisture absorption begins. This part is compliant to JEDEC level 4. UNITS IN A SEALED MOISTURE-PROOF OPENED (UNSEALED) NO BAKING YES IS NECESSARY PERFORM RECOMMENDED BAKING CONDITIONS Figure 14. Baking conditions. Baking Conditions If the parts are not stored in dry conditions, they must be baked before reflow to prevent damage to the parts ...

Page 12

... The cool down rate, R5, from the liquidus point of the solder (77 F) should not exceed -3 C per second maximum. This limitation is necessary to allow the PC board and HSDL-3603 castellation I/O pins to change dimensions evenly, putting minimal stresses on the HSDL-3603 transceiver. ...

Page 13

... Appendix A: HSDL-3603 SMT Assembly Application Note 1.0. Solder Pad, Mask, and Metal Solder Stencil Aperture STENCIL APERTURE SOLDER MASK Figure 16. Stencil and PCBA. 1.1. Recommended Land Pattern for HSDL-3603 Dimension mm inches a 2.00 0.079 b 0.70 0.028 c (pitch) 1.00 0.039 d 2.50 0.098 e 1.51 0.059 f 3.09 0.122 g 2.84 0.112 13 METAL STENCIL FOR SOLDER PASTE ...

Page 14

Adjacent Land Keep-out and Solder Mask Areas Dimension mm inches h min. 0.2 min. 0.008 j 10.8 0.425 k 5.1 0.201 l 3.2 0.126 • Adjacent land keep-out is the maximum space occupied by the unit relative to the ...

Page 15

Recommended Metal Solder Stencil Aperture It is recommended that only 0.152 mm (0.006 inches) or 0.127 mm (0.005 inches) thick stencil be used for solder paste See Figure 18 t, nominal stencil thickness mm inches 0.152 0.006 0.127 0.005 ...

Page 16

Appendix B: PCB Layout Suggestion The following PCB layout guide- lines should be followed to obtain a good PSRR and EM immunity, resulting in good electrical performance. Things to note: 1. The AGND pin should be connected to the ground ...

Page 17

... LED current over different ranges The recommended CC selection tabulated in the table on page 3. The HSDL-3603 typically provides 180 mW/Sr of intensity at the recommended minimum peak pulse LED current of 400 mA. Interface to Recommended I/O chips The HSDL-3603’s TXD data input is buffered to allow for CMOS drive levels ...

Page 18

... Super I/O and Infrared Controller chips, IR link can be realized with the following connections: • Connect IRTX of the National Super I Controller to TXD (pin 3) of the HSDL-3603. • Connect IRRX1 of the National Super I Controller to RXD (pin 4) of the HSDL-3603. • Connect IRSL0 of the National ...

Page 19

... Controller chips, IR link can be realized with the following connections: • Connect IRTX of the SMC Super or Ultra I/O Controller to TXD (pin 3) of the HSDL-3603. • Connect IRRX of the SMC Super or Ultra I/O Controller to RXD (pin 4) of the HSDL-3603. • Connect IRMODE of the Super or Ultra I/O Controller to SD/Mode (pin 5) of the HSDL- 3603 ...

Page 20

Mobile Phone and PDA Platform The block diagrams below show how the IrDA port fits into a mobile phone and PDA platform. MICROPHONE AUDIO INTERFACE SPEAKER RF INTERFACE TRANSCEIVER MOD/ DE-MODULATOR USER INTERFACE Figure 23. IR layout in mobile ...

Page 21

... The depth of the LED image in- side the HSDL-3603 mm. ‘A’ is the required half angle for viewing. For IrDA compliance, the minimum is 15 and the maxi- mum is 30 ...

Page 22

Aperture Width (x, mm) Module Depth, (z) mm max. 0 16.318 1 17.472 2 18.627 3 19.782 4 20.936 5 22.091 6 23.246 7 24.401 8 25.555 9 26.710 APERTURE WIDTH (X) vs. MODULE DEPTH ...

Page 23

Window Material Almost any plastic material will work as a window material. Polycarbonate is recommended. The surface finish of the plastic should be smooth, without any texture filter dye may be used in the window to make it ...

Page 24

For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (408) 654-8675 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6271 ...

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