hsdl-3612 Avago Technologies, hsdl-3612 Datasheet

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hsdl-3612

Manufacturer Part Number
hsdl-3612
Description
Irda Data Compliant 115.2kb/s 3v To 5v Infrared Transceiver - Agilent Hewlett-packard
Manufacturer
Avago Technologies
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
hsdl-3612#007
Manufacturer:
AVAGO
Quantity:
24 400
Part Number:
hsdl-3612-008
Manufacturer:
AGILENT
Quantity:
20 000
Part Number:
hsdl-3612-037
Manufacturer:
Avago
Quantity:
1 429
Description
The HSDL-3612 is a low-profile
infrared transceiver module that
provides interface between logic
and IR signals for through-air,
serial, half-duplex IR data link.
The module is compliant to IrDA
Data Physical Layer Specifications
1.4 and IEC825-Class 1 Eye Safe.
Functional Block Diagram
MD0 (4)
MD1 (5)
RXD (8)
TXD (9)
GND (7,3)
HSDL-3612
V
AGND (2)
CC
SP
LEDA (10)
R1
CX1
CX2
V
CC
(1)
Agilent HSDL-3612
IrDA
3 V to 5 V Infrared Transceiver
Data Sheet
Applications
• Digital imaging
• Data communication
• Telecommunication products
• Small industrial & medical
– Digital still cameras
– Photo-imaging printers
– Notebook computers
– Desktop PCs
– Win CE handheld products
– Personal Digital Assistants
– Printers
– Fax machines, photocopiers
– Screen projectors
– Auto PCs
– Dongles
– Set-Top box
– Cellular phones
– Pagers
instrumentation
– General data collection devices
– Patient & pharmaceutical data
(PDAs)
collection devices
®
Data Compliant 115.2 kb/s
Features
• Fully compliant to IrDA 1.0
• Typical link distance > 1.5 m
• IEC825-Class 1 eye safe
• Low power operation range
• Small module size
• Complete shutdown
• Low shutdown current
• Adjustable optical power
• Integrated EMI shield
• Edge detection input
• Interface to various super
• Designed to accommodate light
• Only 2 external components are
physical layer specifications
– 9.6 kb/s to 115.2 kb/s operation
– 2.7 V to 5.25 V
– 4.0 x 12.2 x 5.1 mm (HxWxD)
– TXD, RXD, PIN diode
– 10 nA typical
management
– Adjustable LED drive-current to
– Excellent noise immunity
– Prevents the LED from long
I/O and controller devices
loss with cosmetic window
required
maintain link integrity
turn-on time

Related parts for hsdl-3612

hsdl-3612 Summary of contents

Page 1

... Description The HSDL-3612 is a low-profile infrared transceiver module that provides interface between logic and IR signals for through-air, serial, half-duplex IR data link. The module is compliant to IrDA Data Physical Layer Specifications 1.4 and IEC825-Class 1 Eye Safe. Functional Block Diagram LEDA (10) TXD (9) SP MD0 (4) ...

Page 2

... The HSDL-3612 contains a high- speed and high-efficiency 870 nm LED, a silicon PIN diode, and an integrated circuit. The IC contains an LED driver and a receiver providing a single output (RXD) for all data rates supported. The HSDL-3612 can be completely shut down to achieve very low power consumption. In ...

Page 3

... To maintain low shutdown current, TXD needs to be driven high or low and not left floating. 3 Symbol V CC AGND GND BACK VIEW (HSDL-3612-007/-037) MD0 MD1 NC GND RXD TXD LEDA BOTTOM VIEW (HSDL-3612-008/-038) TX Function Shutdown Full Distance Power 2/3 Distance Power 1/3 Distance Power Outputs EI LED X On [1] High Off Low Off Low Not Valid ...

Page 4

... F 20%, Tantalum Notes: 4. CX1 must be placed within 0 the HSDL-3612 to obtain optimum noise immunity "HSDL-3612 Functional Block Diagram" on page assumed that Vled and V voltage and filter capacitors. In case the 2 pins are powered by different supplies CX2 is applicable for Vled and CX1 for V ...

Page 5

Absolute Maximum Ratings Parameter Symbol Storage Temperature T S Operating Temperature LED Current I LED Peak LED Current I LED LED Anode Voltage V LEDA Supply Voltage Vcc Transmitter Data I TXD Input Current Receiver Data ...

Page 6

Electrical & Optical Specifications Specifications hold over the Recommended Operating Conditions unless otherwise noted. Unspecified test conditions can be anywhere in their operating range. All typical values are and 3.3 V unless otherwise noted. Parameter Transceiver Supply ...

Page 7

Electrical & Optical Specifications Specifications hold over the Recommended Operating Conditions unless otherwise noted. Unspecified test conditions can be anywhere in their operating range. All typical values are and 3.3 V unless otherwise noted. Parameter Receiver [7] ...

Page 8

TXD “Stuck ON” Protection TXD LED t pw (MAX.) RXD Output Waveform V OH 90% 50% 10 LED Optical Waveform LED ON 90% 50% 10% LED OFF t r Receiver Wake Up Time Definition (when MD0 ...

Page 9

... HSDL-3612-007 and HSDL3612-037 Package Outline with Dimension and Recommended PC Board Pad Layout PIN FUNCTION PIN FUNCTION AGND 7 GND 3 GND 8 RXD 4 MD0 9 TXD 5 MD1 10 LEDA 2.45 0.80 1.20 4.05 SIDE VIEW ALL DIMENSIONS IN MILLIMETERS (mm). DIMENSION TOLERANCE IS 0.20 mm UNLESS OTHERWISE SPECIFIED. PIN 10 0.70 4.95 10 CASTELLATION: PITCH 1.1 ± ...

Page 10

... HSDL-3612-008 and HSDL3612-038 Package Outline with Dimension and Recommended PC Board Pad Layout 0.36 0.53 0.47 0.85 0.31 0.83 0.31 2.08 0.42 0.84 0.94 4.65 10 11.7 5 2.5 0.3 1.46 2.57 3.24 3. 12.2 +0.10 - 0.00 11.7 +0.05 - 0.00 0.1 3.85 4.16 +0.05 - 0.00 2.08 0.28 1.77 2.15 +0.05 - 0.00 0.1 0.94 1.95 0.8 0.73 ...

Page 11

... SHAPE AND DIMENSIONS OF REELS A 10° 4 1.55 ± 0.05 3 5° (MAX.) 4.4 A 5.20 ± 0. SECTION A-A 11 QUANTITY = 400 PIECES PER REEL (HSDL-3612-007) 1800 PIECES PER TAPE (HSDL-3612-037) (40 mm MIN.) EMPTY 2.00 ± 0.50 DIRECTION OF PULLING 5 6 2.00 ± 0.10 4.00 ± 0.10 1.5 ± 0 8.00 ± 0.10 7 (400 mm MIN.) PARTS LEADER ...

Page 12

... Ao and Bo measured on a place 0.3 mm above the bottom of the pocket measured from a place on the inside bottom of the pocket to top surface of carrier. 5. Pocket position relative to sprocket hole measured as true position of pocket, not pocket hole. 12 QUANTITY = 400 PIECES PER REEL (HSDL-3612-008) 1800 PIECES PER TAPE (HSDL-3612-038) (40 mm MIN.) EMPTY ...

Page 13

... Moisture Proof Packaging All HSDL-3612 options are shipped in moisture proof package. Once opened, moisture absorption begins. UNITS IN A SEALED MOISTURE-PROOF OPENED (UNSEALED) LESS THAN 30°C, AND LESS THAN NO BAKING YES IS NECESSARY THAN 72 HOURS PERFORM RECOMMENDED BAKING CONDITIONS 13 PACKAGE PACKAGE IS ENVIRONMENT 60% RH ...

Page 14

... The cool down rate, R5, from the liquidus point of the solder (77 F) should not exceed -3 C per second maximum. This limitation is necessary to allow the PC board and HSDL-3612 castellation I/O pins to change dimensions evenly, putting minimal stresses on the HSDL-3612 transceiver. ...

Page 15

... Appendix A: HSDL-3612-007/-037 SMT Assembly Application Note 1.0 Solder Pad, Mask and Metal Solder Stencil Aperture STENCIL APERTURE SOLDER MASK Figure 1.0. Stencil and PCBA. 1.1 Recommended Land Pattern for HSDL-3612-007/-037 Dim. mm Inches a 2.40 0.095 b 0.70 0.028 c (pitch) 1.10 0.043 d 2.35 0.093 e 2.80 0.110 f 3.13 0.123 g 4.31 0.170 15 METAL STENCIL ...

Page 16

... Note: Wet/Liquid Photo-Imaginable solder resist/mask is recommended LENS LAND h Y Figure 3.0. HSDL-3612-007/-037 PCBA – Adjacent land keep-out and solder mask. Rx LENS k SOLDER MASK l ...

Page 17

Recommended Metal Solder Stencil Aperture It is recommended that only 0.152 mm (0.006 inches) or 0.127 mm (0.005 inches) thick stencil be used for solder paste See Fig 4.0 t, nominal stencil thickness mm inches 0.152 0.006 0.127 0.005 ...

Page 18

Tolerance for X-axis Alignment of Castellation Misalignment of castellation to the land pad should not exceed 0 approximately half the width of the castellation during Photo 1.0. Castellation misaligned to land pads in x-axis before reflow. 3.2 ...

Page 19

... This will enable sufficient land 1 length (minimum of / land 2 length.) to form a good joint. See Fig 5.0. 3.4 Example of Good HSDL-3612- 007/-037 Castellation Solder Joints This joint is formed when the printed solder paste volume is adequate, i.e. 0.30 cubic mm and reflowed properly. It should be reflowed in IR Hot-air convection reflow oven. Direction of board travel does not matter ...

Page 20

... Appendix B: HSDL-3612-008/-038 SMT Assembly Application Note 1.0. Solder Pad, Mask, and Metal Solder Stencil Aperture STENCIL APERTURE SOLDER MASK Figure 1. Stencil and PCBA. 1.1. Recommended Land Pattern for HSDL-3612-008/-038 Dim. mm inches a 1.95 0.077 b 0.60 0.024 c (pitch) 1.10 0.043 d 1.60 0.063 e 5.70 0.224 f 3.80 0.123 g 2.40 0.170 LENS ...

Page 21

Y-axis Misalignment of Castellation In the Y-direction, the unit does not self-align after solder reflow recommended that the unit be placed in line with the fiducial mark (mid-length of land pad). This will enable sufficient land length ...

Page 22

... D Z'=Z+t/n where ‘t’ is the thickness of the window and ‘n’ is the refractive index of the window material. The depth of the LED image inside the HSDL-3612 8mm. ‘A’ is the required half angle for viewing. For IrDA 0 compliance, the minimum and the maximum is 30 ...

Page 23

Aperture Width (x, mm) Module Depth, (z) mm max. 0 16.318 1 17.472 2 18.627 3 19.782 4 20.936 5 22.091 6 23.246 7 24.401 8 25.555 9 26.710 APERTURE WIDTH (X) vs MODULE DEPTH ...

Page 24

Window Material Almost any plastic material will work as a window material. Polycarbonate is recommended. The surface finish of the plastic should be smooth, without any texture filter dye may be used in the window to make it ...

Page 25

For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (408) 654-8675 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6756 ...

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