hsdl-3000 Avago Technologies, hsdl-3000 Datasheet

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hsdl-3000

Manufacturer Part Number
hsdl-3000
Description
Irda Data Compliant 115.2 Kbps Infrared Transceiver - Agilent Hewlett-packard
Manufacturer
Avago Technologies
Datasheet

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Part Number
Manufacturer
Quantity
Price
Part Number:
hsdl-3000#007
Manufacturer:
AGILENT
Quantity:
8 000
Description
The HSDL-3000 is a small form
factor infrared (IR) transceiver
module that provides interface
between logic and IR signals for
through-air, serial, half-duplex IR
data link. The module is compliant
to IrDA Physical Layer Specifica-
tions 1.3 and is IEC 825-Class 1
eye safe.
The HSDL-3000 can be shut down
completely to achieve very low
power consumption. In the shut-
down mode, the PIN diode will be
inactive and thus producing very
little photocurrent even under very
bright ambient light. Such features
are ideal for battery-operated
handheld products.
The HSDL-3000 has two front
packaging type options (HSDL-
3000#007/017). Both options have
an integrated shield that helps to
ensure low EMI emission and high
immunity to EMI field, thus
enhancing reliable performance.
HSDL-3000 Ordering Information
Part Number
HSDL-3000#007
HSDL-3000#017
Packaging Type
Tape/Reel
Strip
Agilent HSDL-3000 # 007/017
IrDA
Infrared Transceiver
Data Sheet
Application Support Information
The Application Engineering
group is available to assist you
with the technical understanding
associated with HSDL-3000
infrared transceiver module. You
can contact them through your
local sales representatives for
additional details.
Applications
• Data communication
• Mobile telecom
• Digital imaging
• Electronic wallet
• Medical and industry data
– PDAs
– Notebooks
– Printers
– Cellular phones
– Pagers
– Smart phones
– Digital cameras
– Photo-imaging printers
collection
®
Data Compliant 115.2 kbps
Package
Front View
Front View
Features
• Fully compliant to IrDA 1.3
• Guaranteed temperature
• Low power consumption
• Small module size
• Withstands >100 mV
• V
• LED stuck-high protection
• IEC 825-Class 1 eye safe
• Designed to accommodate light loss
specifications:
– 2.4 kbps to 115.2 kbps
– Excellent nose-to-nose operation
– Typical link distance > 1.5 m
performance, –20 to 70 C
– Critical parameters are
– Low shutdown current
– Complete shutdown for
– 2.70 x 9.10 x 3.65 mm (HxWxD)
ripple typically
with cosmetic windows
CC
guaranteed over temperature and
supply voltages
(10 nA typical)
TXD, RXD, and PIN diode
supply 2.7 to 5.5 volts
Quantity
2500
10
p-p
power supply

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hsdl-3000 Summary of contents

Page 1

... IR data link. The module is compliant to IrDA Physical Layer Specifica- tions 1.3 and is IEC 825-Class 1 eye safe. The HSDL-3000 can be shut down completely to achieve very low power consumption. In the shut- down mode, the PIN diode will be inactive and thus producing very little photocurrent even under very bright ambient light ...

Page 2

... CX2 6.8 F 20%, Tantalum Notes: 1. CX1 must be placed within 0 HSDL-3000 to obtain optimum noise immunity environments with noisy power supplies, supply rejection can be enhanced by including CX2 as shown in ”HSDL-3000 Functional Block Diagram“on page 2. Caution: The BiCMOS inherent to the design of this component increases the component’s susceptibility to damage from electrostatic discharge (ESD) ...

Page 3

Absolute Maximum Ratings For implementations where case to ambient thermal resistance is 50 C/W. Parameter Storage Temperature Operating Temperature LED Supply Voltage Supply Voltage Output Voltage: RXD LED Current Pulse Amplitude Recommended Operating Conditions Parameter Symbol Operating Temperature T Supply ...

Page 4

Electrical & Optical Specifications Specifications (Min. and Max. values) hold over the recommended operating conditions unless otherwise noted. Unspecified test conditions may be anywhere in their operating range. All typical values (Typ.) are with V set to ...

Page 5

Electrical & Optical Specifications (Continued) Parameter Symbol Transceiver Input Current High I H Low I L Supply Current Shutdown I CC1 Idle I CC2 Active I CC3 Notes in-band optical signal is a pulse/sequence where the peak wavelength, ...

Page 6

... HSDL-3000#007 and HSDL-3000#017 Package Outline with Dimension and Recommended PC Board Pad Layout 1.35 1.25 0.70 2.95 1 0.425 1. 9.10 ± 0.15 2.65 2.60 5. PITCH 1.55 (5X) 0.65 (4 PLACES) RECOMMENDED LAND PATTERN 3.13 3. 0.25 1.55 8.60 2.70 ± 0.15 1.55 3.65 0.60 (2 PLACES) DIMENSIONS 0.55 HEIGHT: 2.70 ± 0.15 mm WIDTH: 9.10 ± 0.15 mm DEPTH: 3.65 ± 0.20 mm UNLESS OTHERWISE STATED, TOLERANCES ± 0.2 mm 1.10 0.50 2.30 0.85 ...

Page 7

... HSDL-3000#007 and HSDL-3000#017 Tape and Reel Dimensions 5.00° (MAX.) POLARITY PIN 6: GND + 9.50 ± 0.10 PIN 1: VLED 0.40 ± 0.10 3.00 ± 0.10 MATERIAL OF CARRIER TAPE: CONDUCTIVE POLYSTYRENE MATERIAL OF COVER TAPE: PVC METHOD OF COVER: HEAT ACTIVATED ADHESIVE DETAIL A LABEL 7 4.00 ± 0.10 1.13 ± 0.10 1.55 ± 0.05 +0.10 3.46 0 +0.10 3.30 0 8.00 ± 0.10 8.00° (MAX.) 3.40 ± 0.20 PROGRESSIVE DIRECTION (40 mm MIN ...

Page 8

... Moisture Proof Packaging The HSDL-3000 is shipped in moisture proof packaging. Once opened, moisture absorption begins. Recommended Storage Conditions Storage Temperature Relative Humidity Below 60% RH Time from Unsealing to Soldering After removal from the bag, the parts should be soldered within three days if stored at the recom- mended storage conditions ...

Page 9

... The cool down rate, R5, from the liquidus point of the solder (77 F) should not exceed –3 C per second maximum. This limitation is necessary to allow the PC board and HSDL-3000 castellation I/O pins to change dimensions evenly, putting mini- mal stresses on the HSDL-3000 transceiver. ...

Page 10

... Appendix A : HSDL-3000#007/#017 SMT Assembly Application Note 1.0 Solder Pad, Mask and Metal Solder Stencil Aperture STENCIL APERTURE SOLDER MASK Figure 1. Stencil and PCBA. 1.1 Recommended Land Pattern for HSDL-3000 DIM. mm INCHES a 2.30 0.091 b 0.85 0.034 c (PITCH) 1.55 0.061 d 1.10 0.043 e 3.05 0.120 f 2.20 0.087 g 2.42 0.095 h 0.20 0.008 Figure 2. Top view of land pattern. ...

Page 11

... The recommended printed solder paste volume required per castellation pad is 0.30 cubic mm (based on either no-clean or aqueous solder cream types with typically 60 to 65% solid content by volume LENS LAND h Y Figure 3. HSDL-3000#007/#017 PCBA – Adjacent land keep-out and solder mask. Tx LENS k SOLDER MASK X l ...

Page 12

Recommended Metal Solder Stencil Aperture It is recommended that only 0.152 mm (0.006 inches) or 0.127 mm (0.005 inches) thick stencil be used for solder paste printing. This is to ensure ad- equate printed solder paste vol- ume and ...

Page 13

... X is the width of the window the height of the window, and Z is the distance from the HSDL-3000 to the back of the window. The distance from the center of the LED lens to the center of the photodiode lens is 5.80 mm. The ...

Page 14

Minimum and Maximum Window Sizes Dimensions are in mm. Depth ( min. 0 7.34 1 7.88 2 8.42 3 8.95 4 9.49 5 10.02 6 10.56 7 11.10 8 11.63 9 12.17 10 12.70 11 13.24 12 13.77 ...

Page 15

Shape of the Window From an optics standpoint, the window should be flat. This en- sures that the window will not alter either the radiation pattern of the LED, or the receive pattern of the photodiode. If the window must ...

Page 16

Test Methods Background Light and Electro- magnetic Field There are four ambient interfer- ence conditions in which the receiver is to operate correctly. The conditions are to be applied separately: 1. Electromagnetic field: 3 V/m maximum (please refer to IEC ...

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